Abstract: It was proposed to combine two successful VCL technologies, wafer fusion and selective oxidation, in a new way to form a long wavelength VCL. The Al(Ga)As oxidation is performed via fusion channels before the actual wafer fusion step. By doing so, the structure combines the advantages of two different, successful long wavelength VCL structures; the double fused and the single fused, oxygen implanted VCL.

Abstract: A system and method for detecting a low battery voltage supplied to a battery operated integrated circuit. A stable reference voltage provided by a bangap reference is compared with the battery voltage. A switched capacitor circuit is used instead of the more conventional resistor combination to supply a scaled representation of the battery voltage. Power requirements are reduced by combining the bandgap reference and the comparator into a single component.

Abstract: A vertical cavity surface emitting laser (VCSEL) and monitoring diode combination having reduced parasitic capacitance for use in high bandwidth communications systems. The VCSEL has both p-type and n-type contacts on the same face. This allows the VCSEL to be mounted on a monitor chip or diode without using a metal contact layer. In an embodiment wherein the VCSEL is soldered to the monitor chip for mechanical stability only a small metal pad no larger than the VCSEL is used.

Abstract: An optical module comprising an optoelectronic board having electrical connection sites for connection with an electrical circuit. The module includes a plurality of optoelectronic devices on the optoelectronic board and an optical fiber connector including a plurality of optical elements each for connection with a respective optoelectronic device. Cooperative alignment members on the optoelectronic board and the optical fiber connector are provided for aligning the optoelectronic devices on the board.

Abstract: An extender for an electrical data bus including a power line and signal lines has first and second electrical connectors for connection to respective electrical connectors attached to respective electrical data buses. The electrical connectors include a data interface circuit for communication with the electrical bus, an optical transmitter and optical receiver electrically connected to the data interface circuit, and driver circuits for the optical transmitter and optical receivers. The driver circuits obtain power from the power line on the local electrical data bus. An optic fiber is connected between the optical transmitters and receivers at respective first and second electrical connectors to transfer data optically between the first and second electrical connectors and thereby extend the range of the data bus.

Abstract: A vertical cavity surface emitting laser (VCSEL) and monitoring diode combination having reduced parasitic capacitance for use in high bandwidth communications systems. The VCSEL has both p-type and n-type contacts on the same face. This allows the VCSEL to be mounted on a monitor chip or diode without using a metal contact layer. In an embodiment wherein the VCSEL is soldered to the monitor chip for mechanical stability only a small metal pad no larger than the VCSEL is used.

Abstract: A top surface emitting vertical cavity laser with enhanced power handling capacity. The laser provides a patterned top electrode for uniformly injecting applied current to the active area. The diameter of the electrode relative to the vertical distance between it and the active layer is reduced by patterning. The result is an improved laser with significant power output.

Abstract: An optical emission device includes a semiconductor with conduction and valence bands and a plurality of quantum wells formed in the conduction and valence bands in a multiple quantum well active region such that recombination of holes and electrons between said quantum wells results in the emission of light. At least some of the quantum wells have different characteristic emission frequencies to broaden the gain spectrum of the emitted light.

Abstract: An optic fiber interface device includes an optical transducer mounted on a first portion of a mounting board, a housing mounted over the optical transducer having a bore aligned with the optical transducer for accommodating an optic fiber and having a cavity on its underside. A lens is mounted in the bore between the optical transducer and the optic fiber. An electronic interface circuit is mounted on a second portion of the mounting board folded up relative to said the portion so that the second portion abuts the housing with the electronic interface circuit located in the cavity. The housing can be mounted on the board using surface mount technology.

Abstract: A method of fabricating a semiconductor device having active components grown on a substrate, involves providing a semiconductor substrate on which the active components are grown, and doping the semiconductor substrate to render it non conductive and thereby reduce parasitic capacitance between active components thereon. The components typically comprise a VCSEL and monitor. The doped substrate reduces parasitic capacitance.

Abstract: A vertical cavity surface emitting laser diode (VCSEL), includes top and bottom electrically non-conductive mirrors defining a first laser cavity containing a laser medium and designed to resonate at a first wavelength. A second laser cavity is designed to resonate at a second wavelength less than the first wavelength. The second laser cavity is optically coupled to the first laser cavity so as to pump the laser medium and create laser action in the first laser cavity. The second laser cavity is normally provided by a VCSEL stacked below the first laser cavity.

Abstract: An adapter for coupling optical and electronic circuits, has a housing including a first portion for mating with an optic fiber termination device, and a second portion for mating with an electronic termination device. At least one electro-optical transducer in the housing has an optical interface for coupling with the optical termination device and an electronic interface for coupling with the electronic termination device. The adapter converts signals between optical and electronic form.

Abstract: A device for generating light with the aid of a semiconducting material consisting of two electrically conducting contact layers and at least one layer, arranged therebetween, of semiconducting material which comprises a light-emitting semiconducting layer which is divided into at least two permanently parallel-connected sub-regions, delimited by semiconducting material with a higher energy gap than the light-emitting layer or delimited by ion-implanted semiconducting material, wherein the delimiting material shall prevent the propagation of dislocations between the sub-regions.

Abstract: A low power pulse amplifier with low duty cycle errors. The amplifier provides several differential amplifier stages with a biasing and canceling network. To minimize duty cycle errors for large input signals, cascode transistors are added between the drains of the differential amplifiers and the outputs. The result is an amplifier having a duty cycle error of less than 5% at amplitude input ranges from 5 millivolts to the supply voltage.

Abstract: A method of reducing the amount of unwanted radiation emitted from a semiconductor laser device involves coating a transparent portion the device intended to transmit radiation with a partially reflective layer.

Abstract: An assembly for use in transferring optical signals from an array of surface-emitting lasers to an array of optical fibers. The laser diodes are mounted on a lead frame type structure in an arrangement which corresponds to the position of optical fibers mounted in an optical fiber ferrule. Complementary alignment means in the lead frame and optical fiber ferrule provides proper positioning of the optical fibers in relation to the laser array when assembled.

Abstract: An optical emission device includes a laser source having an emitting surface, and a sensor laterally adjacent the laser source generating an output signal dependent on the amount of light falling on its detection surface. A transparent waveguide is located in front of the emitting surface and extends generally parallel thereto such that light striking the waveguide in a direction normal to the emitting surface passes straight through the waveguide. A coupling medium is placed between the emitting surface and the waveguide. A light dispersant in the coupling medium causes a fraction of the laser light to strike the waveguide at an oblique angle so that it can enter the waveguide and be carried thereby to the sensor. An important advantage of the invention is that is uses inexpensive passive parts. The assembly process easy to implement, and the parts are stable during temperature changes. As a result only a small tracking error occurs.

Abstract: A multiple function, electromagnetically shielded optical module employing flip chip bonded semiconductor lasers. The module positions a series of opto electronic dies on guides provided on an optical source. The dies may be simply stacked upon one another to form a passively aligned module. The shielding substantially reduces electrical cross talk and other sources of electromagnetic interference.