Abstract: An abnormality diagnosis device includes: a first interface to obtain a value of a driving current for driving a motor; and a processor to access a database including calculation data to be used to calculate a degree of abnormality of the motor, wherein the processor extracts a feature quantity for calculating the degree of abnormality from a current waveform specified by a value of the driving current, and calculates the degree of abnormality of the motor based on the extracted feature quantity and the calculation data.

Abstract: An ultrasonic transducer includes a diaphragm and a housing. The diaphragm can be vibrated. The housing is connected to the diaphragm. The diaphragm is provided with an opening. The housing is provided with an internal space. The internal space communicates with the opening. The diaphragm and the housing constitute an acoustic resonance structure to amplify with the opening and the internal space, ultrasound generated by vibration of the diaphragm, and they are integrally formed.

Abstract: An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vacuum-suck a space between an outer frame, the dicing sheet, and the stage. The plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.

Abstract: A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.

Abstract: An object of the present disclosure is to provide a machine learning device, a degree of severity prediction device, and a machine learning method capable of accurately predicting the degree of severity based on a situation. The machine learning device according to the present disclosure includes a learning unit configured to learn a degree of severity of problem solving for a target component item based on a data set that associates determination data regarding a risk of the target component item with a problem that has occurred in software development and state variables regarding the risk.

Abstract: When a tall vehicle stops near an access point, reception of application information from the access point may be hindered. Calculation as to whether or not a radio wave from the access point is blocked by an obstacle such as a tall vehicle is performed on the basis of obstacle information created by the access point. If the radio wave is blocked, connection to another access point around the access point from which the radio wave is blocked is searched for.

Abstract: The semiconductor device includes: a heat spreader; a first solder layer; a second solder layer; a semiconductor element including a first surface bonded to the heat spreader through the first solder layer, a second surface facing the first surface, a first electrode disposed on the first surface, and a second electrode disposed on the second surface; a block bonded to the second electrode through the second solder layer; a sheet including a first portion, and a second portion having insulating properties and being in contact with the heat spreader; a first lead frame welded to the heat spreader; a second lead frame welded to the block; and a sealant having insulating properties and sealing the first and second lead frames, the heat spreader, the first and second solder layers, the semiconductor element, and the block.

Abstract: To provide a transmission system capable of ensuring reliability of signal transmission. The transmission system includes: a remote unit alternately outputting pulse voltage with a positive polarity and pulse voltage with a negative polarity as a signal by causing a first switching element and a second switching element to alternately open and close; and a master unit accepting input of a signal from the remote unit via a cable, and separating the signal into a first signal corresponding to the pulse voltage with the positive polarity and a second signal corresponding to the pulse voltage with the negative polarity.

Abstract: A semiconductor device includes: an N? drift layer of a first conductivity type formed in the semiconductor substrate; a P base layer formed on the N? drift layer; and an N buffer layer of the first conductivity type formed under the N? drift layer and higher in peak impurity concentration than the N? drift layer. The N buffer layer includes: a first buffer layer in which a trap level derived from lattice defect is not detected by a photoluminescence method; and a second buffer layer provided between the first buffer layer and the N? drift layer and in which two types of trap levels derived from lattice defect are detected by the photoluminescence method.

Abstract: A first on-board device installed on a first train controls an emergency brake unit. When it is determined that an actual deceleration value is insufficient in comparison with a predetermined emergency brake reference deceleration value, the first on-board device predicts a first stop location based on the actual deceleration value, and sends, to a ground control device, a first signal indicating insufficient deceleration and a first stop location signal representing the first stop location predicted. The ground control device sends the first signal and the first stop location signal to a second on-board device of a second train traveling ahead of the first train. The second on-board device invalidates a preset first run curve, over a range from a second train location representing an on-track location of the second train to a stop limit location of the second train, and generates a second run curve to control the second train.

Abstract: An antenna device is configured to include: a divider circuit including an input/output terminal and a plurality of divider terminals; a plurality of matching circuits including one ends connected with the divider terminals; and a plurality of antenna elements connected with other ends of the matching circuits. Furthermore, the matching circuits are lossless circuits each having only an inductance component and a capacitance component, and the divider circuit is a lossless circuit whose characteristic impedance is indicated only by the inductance component and the capacitance component.

Abstract: In an air-conditioning apparatus including a heat exchanger to switch between serving as an evaporator and serving as a condenser, the heat exchanger includes a first heat exchanger, a second heat exchanger, and a connection pipe. The first heat exchanger includes a first header divided into a plurality of chambers and connected with one end of each of the first heat transfer tubes, and a second header extending in a horizontal direction and connected with the other end of each of the first heat transfer tubes. The second heat exchanger includes a plurality of second heat transfer tubes, a third header extending in the horizontal direction and connected with one end of each of the second heat transfer tubes, and a fourth header extending in the horizontal direction and connected with the other end of each of the second heat transfer tubes.

Abstract: A coil device includes a core having a loop-shaped magnetic path and a first winding part. The first winding part is wound around the core so as to pass through an inner region of the core surrounded by the core. In the inner region of the core and an outer region of the core, a metal base substrate in which a coil pattern is formed with an insulating layer interposed on a metal base body is disposed. A cooling body is thermally bonded to a side of the metal base body opposite to a side where the insulating layer and the coil pattern are formed. The first winding part includes the coil pattern.

Abstract: Production efficiency in a production line is improved. A work assistance apparatus includes a profile information evaluation unit that evaluates degree of change in profile information based on worker information and production facility information, a correction estimation unit that estimates a correction method of profile information and a correction effect caused by the correction method based on evaluation in the profile information evaluation unit, and an instruction determination unit that determines a correction instruction for at least one of a worker and a production facility to perform correction based on a corresponding correction method based on a correction effect.

Abstract: According to the present disclosure, a semiconductor apparatus comprises a housing a semiconductor chip installed in the housing, and a first radio tag installed on the housing. The first radio tag is installed in a state where rewriting from outside is not limited.

Abstract: A semiconductor device according to the present disclosure includes: a semiconductor substrate including at least: an n-type first semiconductor layer; an n-type second semiconductor layer on the first semiconductor layer; a p-type third semiconductor layer on the second semiconductor layer; and an n-type fourth semiconductor layer on an upper layer part of the third semiconductor layer; a plurality of first trench gates passing through the fourth to second semiconductor layers to reach an inner side of the first semiconductor layer; and a first main electrode having contact with the fourth semiconductor layer; wherein the plurality of first trench gates are disconnected in an electrode extraction region provided in a center part of the active region where main current flows, and are connected to the first main electrode in a first electrode extraction part connected to the first gate electrode in the disconnected part.

Abstract: A power conversion device includes a semiconductor element, a temperature sensor, a sealing material sealing the semiconductor element, and a driving circuit for the semiconductor element. The temperature sensor measures the temperature of either or both of the semiconductor element and the sealing material. The driving circuit controls a voltage steepness or a voltage crest value to be applied to the semiconductor element, on the basis of temperature information measured by the temperature sensor.

Abstract: Provided is an elevator system which can easily supply power to an elevator. The elevator system includes a coordinating device configured to command an autonomous mobile body which moves inside a building provided with an elevator to supply power to the elevator in a case where the coordinating device determines that a supply of power from the autonomous mobile body to the elevator is necessary. According to the elevator system, the autonomous mobile body supplies power to the elevator when the supply of power to the elevator is necessary. Therefore, power can be easily supplied to the elevator.

Abstract: An air-conditioning apparatus includes a refrigerant circuit, a thermal imaging sensor acquiring thermal information on an air-conditioned room, and a wireless LAN communication unit including an interface board connector and a wireless LAN interface. The interface board connector connects to an operation information signal line, through which operation information on the refrigerant circuit is transferred, and a thermal-imaging-sensor information signal line, through which thermal-imaging-sensor information based on the thermal information on the air-conditioned room acquired by the thermal imaging sensor is transferred. The wireless LAN interface separately transmits the operation information, transferred through the operation information signal line connected to the interface board connector, and the thermal-imaging-sensor information, transferred through the thermal-imaging-sensor information signal line connected to the interface board connector, to an external electronic device.