Abstract: An object of the present invention is to provide a method for producing 2,4-dialkylbenzaldehyde with excellent conversion rate and yield, and excellent regioselectivity for formylation, by allowing carbon monoxide to react on a starting material containing a specific m-dialkylbenzene in the presence of hydrogen fluoride and boron trifluoride. The method for producing 2,4-dialkylbenzaldehyde according to the present invention comprises a step of allowing carbon monoxide to react on a starting material containing m-dialkylbenzene represented by formula (1) in the presence of hydrogen fluoride and boron trifluoride for formylation at least at a position (a), wherein the starting material is a dialkylbenzene containing more than 90 mol % of m-dialkylbenzene represented by formula (1), and the number of moles of boron trifluoride relative to 1 mole of m-dialkylbenzene represented by formula (1) is 0.7 mol or more and 3.

Abstract: A cleaning composition for semiconductor substrates, containing an alkaline compound (A), a corrosion inhibitor (B), and water, wherein the alkaline compound (A) is at least one selected from the group consisting of a quaternary ammonium hydroxide (A1) and potassium hydroxide (A2), and the corrosion inhibitor (B) is at least one selected from the group consisting of 4-substituted pyrazoles, potassium tris(1-pyrazolyl)borohydride, 2-(4-thiazolyl)benzimidazole, and halogenated-8-hydroxyquinolines.

Abstract: Provided are a glycidyl (meth)acrylate composition, which includes a phenolic polymerization inhibitor that is unlikely to deteriorate such that the glycidyl (meth)acrylate composition can be stably stored for a long period of time, and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate resin composition. More specifically, provided are: a glycidyl (meth)acrylate composition including a glycidyl (meth)acrylate, a quaternary ammonium salt, a strong acid salt, and a phenolic polymerization inhibitor; and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate composition, the method including adjusting the content of a strong acid salt in the glycidyl (meth)acrylate composition to a certain amount relative to an amount of a quaternary ammonium salt by mole.

Abstract: An oxymethylene-copolymer manufacturing method includes: polymerizing a polymerization raw material containing trioxane and a comonomer in the presence of an acid catalyst in a quantity that is 1.0×10?8 moles to 5.0×10?6 moles with respect to 1 mole of trioxane; adding a hydroxylamine compound represented by general formula (1) (in the formula, R1 and R2 are, independently of each other, a hydrogen atom or an organic group having 1-20 carbon atoms) to a reaction product obtained during the polymerizing of the polymerization raw material at 50-5000 times the quantity of the acid catalyst, in terms of the molar quantity, and mixing the hydroxylamine compound with the reaction product; and subjecting the mixture of the reaction product and the hydroxylamine compound, which is obtained during the adding of the hydroxylamine compound, to an additional melt-kneading.

Abstract: According to the present invention, a resin composition can be provided, which comprises a solvent represented by general formula (1) and a polycarbonate resin containing a structural unit (a) represented by general formula (A) (provided that a polycarbonate homopolymer composed only of a structural unit represented by formula (i) is excluded). (In formula (1), Ra represents a hydrogen atom or the like; Rb represents an alkyl group having 1 to 20 carbon atoms which may have a substituent, or the like; Rc to Rf independently represent a hydrogen atom or the like; and n represents an integer of 1 to 10.) (In formula (A), R1 to R8 independently represent a hydrogen atom or the like; and X represents —O— or the like.

Abstract: A carbon dioxide absorbent containing a polyamine compound (A) having an alicyclic hydrocarbon structure, wherein a content of the polyamine compound (A) is 60% by mass or more.

Abstract: A polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1) to (1-4) and prescribed polycarbonate constituent units.

Abstract: Provided is an optical lens formed by integrally molding a lens part that is an optically effective portion and has a light incidence/emission surface, and a lens edge part that is an optically ineffective portion and has a surface thereof except the light incidence/emission surface. The lens edge part includes a non-transparent region in part or all thereof, the lens part and the lens edge part include a thermoplastic resin, and the non-transparent region in the lens edge part contains a total of 0.1-5 mass % of one or more of a black dye and a black pigment.

Abstract: Provided is a production method for an all-solid-state battery having a solid electrolyte layer between a positive electrode layer and a negative electrode layer, the production method including: coating or impregnating the positive electrode layer and/or the negative electrode layer with a solid electrolyte solution in which a boron hydride compound serving as the solid electrolyte has been dissolved in a solvent; and removing the solvent from the coated or impregnated solid electrolyte solution and causing the solid electrolyte to precipitate on the positive electrode layer and/or the negative electrode layer.

Abstract: Provided is a composition for cleaning semiconductor substrates, having high removal rate of tungsten oxide with high Ti/W etching selectivity. The composition for cleaning semiconductor substrates, comprising an oxidizing agent (A), a fluorine compound (B), a metallic tungsten corrosion inhibiter (C), and a tungsten oxide etching accelerator (D), wherein the addition ratio of the oxidizing agent (A) is from 0.0001 to 10% by mass relative to the total mass of the composition for cleaning semiconductor substrates; the addition ratio of the fluorine compound (B) is from 0.005 to 10% by mass relative to the total mass of the composition for cleaning semiconductor substrates; and the addition ratio of the metallic tungsten corrosion inhibiter (C) is from 0.0001 to 5% by mass relative to the total mass of the composition for cleaning semiconductor substrates.

Abstract: A composition for an oil or gas well formation, containing a viscoelastic surfactant; and a modified nanomaterial and a producing method of the composition, and a forming method of the oil or gas well. The modified nanomaterial optionally contains a nanocellulose. The modified nanomaterial optionally has, on its surface, a sulfate group, a sulfite group, a carboxy group, an ethylene oxide chain, an amino group, an ester group, a silane group, a tertiary ammonium group or a mixture thereof.

Abstract: A polycarbonate resin having a high refractive index, a low Abbe number and a high moisture and heat resistance is provided. In an embodiment, a polycarbonate resin including a structural unit represented by general formula (1) below is provided.

Abstract: Provided is a thermoplastic resin laminate suitable for optical applications of transparent substrate materials and protective materials. The thermoplastic resin laminate includes a first layer including an amorphous polyester resin (A) as the main component, and a second layer including a (meth)acrylic resin (B) as the main component on the first layer.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.

Abstract: The present invention makes it possible to provide a compound represented by formula (1) and a composition for an optical material containing this compound. (Where m+n=4, m represents an integer of from 0 to 3, and n represents an integer of from 1 to 4.) In addition, the present invention makes it possible to provide a method for producing an optical material, the method including a step for adding 0.0001-10 parts by mass of a polymerization catalyst per 100 parts by mass of the composition for an optical material, polymerizing, and curing.

Abstract: A carbon dioxide absorbent containing an amine compound (A) having a heterocyclic structure (X) selected from the group consisting of an oxygen-containing heterocyclic structure and a sulfur-containing heterocyclic structure, a content of the amine compound (A) being 65% by mass or more.

Abstract: A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.

Abstract: Provided is a molding technique with which a molding operation is performed smoothly, preventing the production of defective products. Also provided is a molding apparatus including a nozzle, a guide member guiding a molding material to the nozzle, and a heating device, the molding apparatus being further provided with a prevention structure configured to prevent the molding material from melting during transportation through the guide member.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 1.5 to 20.0 parts by mass, an epoxy resin composition, and an epoxy resin curing agent for an amine composition. In the formula (1), R1 is an alkyl group having 1 to 6 carbon atoms optionally having a hydroxy group, R2NHCH2—, where R2 represents an alkyl group having 1 to 6 carbon atoms, or a group represented by the following formula (1A), and p is a number of 0 to 2. In the formula (1A), R3 represents a hydrogen atom or NH2—.

Abstract: A bisimide phenyl ester acid dianhydride represented by the following formula (2): where R3 and R4 each independently represents a hydrogen atom or an organic group having 1 to 10 carbon atoms; each m is independently an integer of 1 to 4; and each A independently represents an aromatic ring or an alicyclic ring.