Patents Assigned to Mitsubishi Material Corporation
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Publication number: 20240178115Abstract: This metal sheet material is made of copper or a copper alloy, and includes a main sheet body and a roughened plating layer that is formed on an outermost surface layer of the main sheet body. An engagement protrusion that protrudes toward the opposite side to the main sheet body and has a widening portion that gradually widens in width toward a tip end side in a protrusion direction is formed in the roughened plating layer. In a cross section of the main sheet body along the thickness direction, a plurality of the engagement protrusions are formed on a surface crystal grain that is located on the outermost surface of the main sheet body.Type: ApplicationFiled: March 23, 2022Publication date: May 30, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Marina Sakamaki, Kenji Kubota, Toyo Ohashi
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Publication number: 20240173777Abstract: A turning tool includes a tool main body that extends along a tool axis and that has a pedestal at a tip portion, a cutting insert that is detachably attached to the pedestal, and a distance sensor that is attached to the tool main body. Herein, the distance sensor is an eddy current sensor. With such a turning tool, accuracy of dimension measurement can be improved.Type: ApplicationFiled: March 15, 2022Publication date: May 30, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yasuharu Imai, Hidebumi Takahashi, Wataru Takahashi
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Patent number: 11992887Abstract: In this drill, a cutting edge, which is formed at an intersecting ridge line part between a wall surface, facing a drill rotation direction, of a chip discharging flute formed at an outer periphery of a tip portion of a drill main body that is rotated around an axis, and a tip flank face, includes an inner peripheral cutting edge located on a radially inner peripheral side with respect to the axis; and an outer peripheral cutting edge connected to a radially outer peripheral side of the inner peripheral cutting edge. A point angle of a portion of the inner peripheral cutting edge on an inner peripheral side with respect to the axis is within a range of 90° to 170°.Type: GrantFiled: April 7, 2020Date of Patent: May 28, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Tadashi Yamamoto, Takahiro Hibi
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Publication number: 20240165699Abstract: There are provided copper particles, in which a surface of a core particle consisting of metallic copper is coated with an organic protective film formed from an organic molecule derived from copper carboxylate, a total concentration of metal impurities having an oxidation reduction potential lower than that of copper is less than 10 ppm by mass, and an average particle diameter of the copper particles in a state where the copper particles are primary particles is more than 50 nm and 200 nm or less. When the copper particles are analyzed using a time-of-flight secondary ion mass spectrometry (TOF-SIMS), an amount of detected CuC2O2H? ions is in a range of 0.02 times or more with respect to an amount of detected Cu+ ions, and an amount of detected C2H3O2? ions is in a range of 0.02 times or more with respect to the amount of the detected Cu+ ions.Type: ApplicationFiled: March 3, 2022Publication date: May 23, 2024Applicants: MITSUBISHI MATERIALS CORPORATION, MITSUBISHI MATERIALS CORPORATIONInventors: Tomohiko Yamaguchi, Kiyotaka Nakaya, Akihiro Higami
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Publication number: 20240165713Abstract: A surface coated cutting tool comprising a substrate and a coating layer on the substrate, the substrate comprising a WC-based cemented carbide comprising a hard phase component of WC grains and a binder phase primarily composed of Co, wherein (a) an interfacial layer is disposed between the substrate and the coating layer; (b) the interfacial layer includes a region A directly above the hard phase component and a region B directly above the binder phase, and the interfacial layer has an average thickness; at the midpoint across the average thickness of the interfacial layer, the W content in the region A ranges from 90 to 99 mass %, while the W content in the region B ranges from 30 to 65 mass %, the C content CA in the region A satisfies CA?0.05 mass %, and the C content CB in the region B satisfies CA?CB?0.09 mass %.Type: ApplicationFiled: March 30, 2021Publication date: May 23, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: Hidetoshi Asanuma
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Publication number: 20240157450Abstract: A coating layer including first sublayers and second sublayers alternately deposited. The first sublayers each has an average thickness in a range of 0.5 nm to 100.0 nm and has an average composition represented by (AlxTi1-x-y-zMy)BzN (M is at least one element selected from the group consisting of groups 4, 5, and 6 elements and lanthanoid elements in the periodic table, 0.100?x?0.640, 0.001?y?0.100, 0.060?z?0.400). The second sublayers each has an average thickness in a range of 0.5 nm to 100.0 nm and has an average composition represented by (AlpCr1-p)N (0.650?p?0.900). The coating layer includes a cutting edge ridge and a flank and has a B content, the B content at the cutting edge being at least 60% of the B content in an area at least 1 mm away from the cutting edge ridge toward the flank.Type: ApplicationFiled: March 11, 2022Publication date: May 16, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Tomoki Ebata, Hidetoshi Asanuma
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Publication number: 20240157449Abstract: The substrate includes a sintered compact containing 40 to 70 vol % cubic boron nitride grains. The substrate has a surface roughness R of 0.1 to 1.5 ?m. The coating layer includes an A layer, a B layer, and a C layer. The A layer having an average composition represented by (Al1-xTix)N (0.35?x?0.60) and an average thickness tA of 0.1 to 1.0 ?m. The B layer having an average composition represented (Al1-y-zTiySiz)N (0.35?y?0.60 and 0.01?z?0.10) and an average thickness tB of 0.2 to 2.0 ?m. The C layer having an average composition represented by (Al1-a-b-cCraSibCuc)N (0.150?a?0.400, 0.050?b?0.200 and 0.005?c?0.050) and an average thickness tC of 0.1 to 2.0 ?m. The ratio tB/tA is 2.0 to 6.0, and R?tC.Type: ApplicationFiled: March 14, 2022Publication date: May 16, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: Masataka Dobashi
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Patent number: 11981574Abstract: The present invention provides a fine silicon powder and the like including fine silicon particles having a microscopically measured particle diameter of 1 ?m or more and an average circularity determined in accordance with Formula (1) of 0.93 or more, in which an average particle diameter based on volume, which is measured by a laser diffraction scattering method, is in a range of 0.8 ?m or more and 8.0 ?m or less, an average particle diameter based on number, which is measured by the laser diffraction scattering method, is in a range of 0.100 ?m or more and 0.150 ?m or less, and a specific surface area, which is measured by a BET method, is in a range of 4.0 m2/g or more and 10 m2/g or less. Circularity=(4×?×projected area of particle)1/2/peripheral length of particle (1).Type: GrantFiled: December 2, 2020Date of Patent: May 14, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshinobu Nakada, Naoki Rikita
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Publication number: 20240150578Abstract: A resin composition according to the present invention is characterized by containing, with respect to 100 parts by mass of the thermoplastic, carbon fibers in a range of 2 parts by mass or more and 70 parts by mass or less and a silane coupling agent in a range of 0.3 parts by mass or more and 7 parts by mass or less.Type: ApplicationFiled: March 28, 2022Publication date: May 9, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Mariko Wakamatsu, Fumiaki Ishikawa, Hiromasa Honjo
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Publication number: 20240149344Abstract: This metal paste for bonding includes a metal powder, a copper salt, an amine, and an alcohol, in which a ratio A/B of a weight A of Cu in the copper salt to a weight B of the metal powder is set to be in a range of 0.02 or more and 0.25 or less, the metal paste is in a paste form in a temperature range of 15° C. or higher and 35° C. or lower, a liquid phase is generated in a temperature raising process starting from 35° C., the liquid phase dissipates in the temperature raising process at a liquid phase generation temperature or higher, and a metal sintered body is formed at a liquid phase dissipation temperature or higher.Type: ApplicationFiled: March 31, 2022Publication date: May 9, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Kohei Otogawa, Takuma Katase
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Publication number: 20240140797Abstract: A nitride semiconductor material having low lattice thermal conductivity and a heat flow switching element including the same are provided. The nitride semiconductor material according to the present invention is a metal nitride represented by M-Si—N—Te (where M represents at least one kind of transition metal element, and Te represents an arbitrary element), and has a thermal effusivity of less than 2000 Ws0.5/m2K. In particular, the M is at least one of Cr, Mn, Ni, Mo, and W. In addition, a heat flow switching element according to the present invention includes an N-type semiconductor layer 3, an insulator layer 4 formed on the N-type semiconductor layer, and a P-type semiconductor layer 5 formed on the insulator layer, wherein at least one of the N-type semiconductor layer and the P-type semiconductor layer is formed from the nitride semiconductor material described above.Type: ApplicationFiled: February 21, 2022Publication date: May 2, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Toshiaki Fujita, Masaki Adachi
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Publication number: 20240139824Abstract: This method is a machining method using a tool body (10, 110) to which a distance sensor (31, 32) is attached, the method including a coordinate setting step of setting each of a cutting edge coordinate with a point of a cutting edge (22, 122) provided at the tool body (10, 110) as reference and a sensor coordinate with a reference point of the distance sensor (31, 32) as reference, a machining step of forming a machined surface using the cutting edge coordinate, and a measurement step of measuring a dimension of the machined surface using the sensor coordinate.Type: ApplicationFiled: March 11, 2022Publication date: May 2, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yasuharu Imai, Hidebumi Takahashi
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Publication number: 20240133011Abstract: This continuous cast wire rod contains Cu: 62.0 mass % or greater and 70.0 mass % or less, Sn: 0.3 mass % or greater and 0.9 mass % or less, Zr: 0.0050 mass % or greater and 0.1000 mass % or less, and P: 0.0050 mass % or greater and 0.1000 mass % or less, with a balance being Zn and impurities, and a mass ratio Zr/P of Zr to P is 0.3 or greater.Type: ApplicationFiled: August 27, 2023Publication date: April 25, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Masahiro Kataoka, Keiichiro Oishi, Shinobu Satou, Kanta Dairaku
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Publication number: 20240132411Abstract: A cBN sintered compact in accordance with an embodiment of the present invention comprises: cBN grains in the amount of 40 vol % or more and 80 vol % or less; and a binder phase containing titanium boride grains. The cBN sintered compact satisfies the following relation: 3.0?X/Y?10.0, where Y is the sum of the lengths of envelopes on which the cBN grains are in contact with the binder phase, and X is the sum of the interfacial lengths of the titanium boride grains that are present within 2 ?m from the surfaces of each cBN grain and have an oblateness of 1.3 or more and 30.0 or less where the oblateness is defined by L2/(4?S), where L is the interfacial length and S is the area of the titanium boride grain.Type: ApplicationFiled: January 28, 2022Publication date: April 25, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Masayuki KOSHIYAMA, Masahiro YANO
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Publication number: 20240132995Abstract: This method for recovering a valuable metal from a used LIB includes: a step of adding, to an electrode assembly taken out of a detoxified used LIB, metallic zinc in an excess amount relative to a mass of the electrode assembly; a step of heating a mixture of the electrode assembly and the metallic zinc to form a molten metal; a step of taking out the molten metal and separating the molten metal into an alloy metal and a slag; and a step of heating the alloy metal to volatilize zinc in the alloy metal, and thereby, recovering an alloy metal of a valuable metal.Type: ApplicationFiled: March 8, 2022Publication date: April 25, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hajime Kawasaki, Atsuhiro Nabei
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Publication number: 20240132351Abstract: Provided is a more appropriate method of producing lithium sulfide having high ionic conductivity and no by-products generated. The method of producing lithium sulfide includes a temperature rising step (Step S14) of reducing lithium sulfate fed into a furnace in a state of heating to a temperature of more than 700° C. under an atmosphere of a reduced pressure of 0.05 MPa or less.Type: ApplicationFiled: March 4, 2022Publication date: April 25, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Fumitake Kikuchi, Kanji Kuba, Shotaro Kakuki
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Publication number: 20240124954Abstract: A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 ?m or more, an aspect ratio of the crystal grain on the rolled surface is set to 2.0 or less, and a length percentage of the small tilt grain boundary and the subgrain boundary with respect to all grain boundaries is set to 80% or less in terms of partition fraction.Type: ApplicationFiled: March 8, 2021Publication date: April 18, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Yuki ITO, Hiroyuki MORI, Norihisa IIDA, Motohiro HITAKA
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Publication number: 20240124955Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size ? in a sheet-thickness central portion is 40 ?m or less.Type: ApplicationFiled: February 8, 2022Publication date: April 18, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yosuke NAKASATO, Kazunari MAKI, Yasuhiro TSUGAWA, U TANI
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Publication number: 20240128530Abstract: A valuable metal recovery method includes: recovering a battery slag from lithium ion battery waste; adding an acid to the battery slag; adding a sulfur compound the leachate; filtering the first processed product to obtain a first processed filtrate; adding a sulfur compound to the first processed filtrate; filtering the second processed product to obtain a second processed filtrate; adding calcium hydroxide to the second processed filtrate; filtering the third processed product to obtain a third processed filtrate; adding sodium carbonate to the third processed filtrate; filtering the processed product; heating the fourth processed filtrate; blowing carbon dioxide or adding a carbonate; and filtering the processed product, wherein a pH of the second processed product is higher than a pH of the first processed product, and a pH of the third processed product is higher than the pH of the second processed product.Type: ApplicationFiled: February 8, 2022Publication date: April 18, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Kenta Kuramochi, Atsushi Miyazaki, Hiroki Muraoka
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Publication number: 20240123515Abstract: The coating film includes a laminated structure including at least one first layer and at least one second layer alternately disposed. The or each first layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlxTi1-x-y-zMy)BzN, where M is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.100?x?0.640, 0.001?y?0.100, and 0.060?z?0.400. The or each second layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlpCr1-p-q-rM?q)BrN, where M? is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.650?p?0.900, 0.000?q?0.100, and 0.000?r?0.050.Type: ApplicationFiled: July 30, 2021Publication date: April 18, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hidetoshi Asanuma, Tomoki Ebata