Patents Assigned to Moldec Co., Ltd.
  • Patent number: 6679709
    Abstract: The invention provides a connector which is easily manufactured and connects a circuit board in good condition. The connector according to the invention is a CPU socket to be surface-mounted on a circuit board 2, comprising a terminal 5 attached inside an internal case 4a made of an insulating material and a solder 6 fixed to the terminal 5. A connecting section 11 of the terminal 5 is provided with a pair of bar-like pieces 12, and has first claw sections 13 and a second claw section 14. In order to fix the solder 6 to the connecting section 11, tip ends of the first claw sections 13 are caulked by bending so that the tip ends contact with each other. The connecting section 11 is provided with an internal passage 15 connecting the upper and lower sides thereof. The solder 6 does not come off the terminal 5 because the solder 6 is attached to the internal case 4a after fixed to the connecting section 11 of the terminal 5 by caulking.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: January 20, 2004
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6676875
    Abstract: A method of forming a receptacle connector insert capable of maintaining constant distances between terminal groups even when a receptacle connector has the terminal groups of three rows or more and of being easily produced, comprising the steps of locking a terminal group (2) positioned at both ends to a pair of metal mold main bodies (4) as shown in FIG. 3(a) and holding a terminal group (2) arranged at the center in a rear core (6), moving a front core (5a) arranged on the right side of a curved part (2b) downward while bending the curved part (2b) as shown in FIG. 3(b), storing the curved part (2b) in a second storing part (10a) as shown in FIG. 3(c), moving a front core (5b) arranged on the left side toward the curved part (2b) as shown in FIG. 3(d) and storing the curved part (2b) in a second storing part (10b) as shown in FIG.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: January 13, 2004
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6666703
    Abstract: A connector has an inner case connected to a circuit board by reflow soldering, an outer case slidable back and forth on the inner case, and a cover covering the surface of a CPU disposed on the outer case. The cover has a plated metal shield on its surface and is electrically connected to an electrically conductive heat radiator through a clip. When the CPU is covered by the cover and the heat radiator is mounted on the CPU, the cover is disposed between the heat radiator and the CPU. Since the CPU is covered by the cover, the heat radiator can be removed from the CPU without posing burdens on the CPU. The shield of the cover is effective to block electromagnetic waves generated by the CPU.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: December 23, 2003
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6575773
    Abstract: The invention provides a connector for surface mounting capable of forming a contact without offsetting so as to assemble in a case in order to solve the disadvantage mentioned above. As shown in FIG. 4(a), a contact (3) formed substantially in a straight line shape is pressure inserted to a through hole (10) provided in a holding part (9) of a case (2). Next, as shown in FIG. 4(b), a connection part (6) of the upper contact (3) is held by upper and lower jigs (12), and a terminal part is gripped by a bending jig (13) provided with a gripping portion having substantially the same diameter as that of the terminal part (7). Next, as shown in FIG. 4(c), the connection part (6) of the upper contact (3) is bent obliquely downward by obliquely downward drawing down the bending jig (13). With respect to the connection part (6) of the lower contact (3), as shown in FIG. 4(d), the connection part (6) of the lower contact (3) is bent obliquely upward by obliquely upward drawing up the bending jig (13).
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: June 10, 2003
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Publication number: 20030092305
    Abstract: A connector has an inner case connected to a circuit board by reflow soldering, an outer case slidable back and forth on the inner case, and a cover covering the surface of a CPU disposed on the outer case. The cover has a plated metal shield on its surface and is electrically connected to an electrically conductive heat radiator through a clip. When the CPU is covered by the cover and the heat radiator is mounted on the CPU, the cover is disposed between the heat radiator and the CPU. Since the CPU is covered by the cover, the heat radiator can be removed from the CPU without posing burdens on the CPU. The shield of the cover is effective to block electromagnetic waves generated by the CPU.
    Type: Application
    Filed: April 25, 2002
    Publication date: May 15, 2003
    Applicant: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Publication number: 20030013330
    Abstract: The invention provides a connector which is easily manufactured and connects a circuit board in good condition. The connector according to the invention is a CPU socket to be surface-mounted on a circuit board 2, comprising a terminal 5 attached inside an internal case 4a made of an insulating material and a solder 6 fixed to the terminal 5. A connecting section 11 of the terminal 5 is provided with a pair of bar-like pieces 12, and has first claw sections 13 and a second claw section 14. In order to fix the solder 6 to the connecting section 11, tip ends of the first claw sections 13 are caulked by bending so that the tip ends contact with each other. The connecting section 11 is provided with an internal passage 15 connecting the upper and lower sides thereof. The solder 6 does not come off the terminal 5 because the solder 6 is attached to the internal case 4a after fixed to the connecting section 11 of the terminal 5 by caulking.
    Type: Application
    Filed: February 1, 2002
    Publication date: January 16, 2003
    Applicant: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6488541
    Abstract: There is provided a connector which allows the hood of a case thereof to be corrected out of a distortion that the hood is suffering, and hence which can easily be connected to another connector. The hood 6 of a receptacle connector, for example, is corrected out of an inward distortion at its center which has been caused when the case 2 is placed alone as shown in FIG. 6(a). First, a pair of upper and lower reception contacts 3 is inserted into through holes 7 defined in a body 5 of a case 2 until the reception contacts 3 are brought into contact with upper and lower inner wall surfaces of the body 5. Then, as shown in FIG. 6(b), a fitting member 4 whose thickness is larger in its front portion than in its rear portion is inserted between the upper and lower reception contacts 3, and fitted into the body 5. Then, as shown in FIG. 6(c), the front portion of the body 5 is spread, correcting a front end portion of the hood 6 into a normal state.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: December 3, 2002
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6474998
    Abstract: Rising of a forwardmost edge of a shield for a connector is prevented without requiring double-sided tape or the like. The connector includes an insulating material casing, terminals attached to the casing, and a metal plate shield on an upper surface of the casing. A terminal portion houses the terminals, with boss portions projecting widthwise of the terminal portion. A flange portion and receiving groove are provided on the forward edge of the casing. First and second concavities exists on upper surfaces of the terminal portion and the boss portion, respectively. First tab portions are pressed into the first concavities, and second tab portions are pressed into the second concavities, making the shield inseparable from the casing. A bent portion at a forwardmost edge of the shield portion is received within the receiving groove for preventing an edge of the shield portion from rising up from the terminal portion.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: November 5, 2002
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi
  • Patent number: 6056122
    Abstract: A transportable storage container includes a box-like cover member having an opened bottom portion, a base member provided under the cover member so as to mount an expensive heavy article such as a metallic mold, and buckles for connecting detachably the cover member and the base member whereby the metallic mold held in the container is protected from rusting due to invasion of water; a space for storing is effectively utilized by stacking a plurality of containers; movement of the container in which the metallic mold is housed is easy by a carrier for exclusive use; and an easier transportation of the container is obtainable when it is transported by a forklift or is transported on the bed of a truck.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: May 2, 2000
    Assignee: Moldec Co., Ltd.
    Inventor: Shinobu Takeuchi