Abstract: A thermoelectric module unit is provided with a thermoelectric module that comprises a partitioning plate, a thermoelectric semiconductor element fixed to the partitioning plate in a state passing through the partitioning plate but also in a state that is electrically insulated from the partitioning plate. A first metal electrode is connected to a first surface of the thermoelectric semiconductor element, and a second metal electrode is connected to a second surface of the thermoelectric semiconductor element. A first confined portion encloses a region from the partitioning plate towards the first surface and is also connected to a first heat pipe. An operating fluid is vacuum-sealed within the first confined portion and the first heat pipe.

Abstract: A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.

Abstract: A thermoelectric chip unit (1) comprises equal numbers of n-type thermoelectric semiconductor elements (30n) and p-type thermoelectric semiconductor elements (30p) that are held embedded within a single chip substrate (2). It is therefore difficult for the crystals of the thermoelectric semiconductor elements (30) to split at the cleavage surfaces thereof. The thermoelectric chip unit (1) can be made to be flexible by forming the chip substrate (2) of a flexible insulator such as plastic or rubber. A thermoelectric unit (4) comprises this thermoelectric chip unit (1) to which are attached electrodes (5). The thermoelectric unit (4) can be made to be flexible by forming the electrodes (5) of flexible members such as thin copper plates. A thermoelectric module (6) comprises the thermoelectric unit (4) to which is attached a flexible sheet or cover (8). This thermoelectric module (6) can be used as a cooling device for a computer's CPU or a semiconductor laser, or in an insulated refrigerator.