Abstract: The invention relates to a method for producing a structured coating on a substrate, wherein the method comprises the following steps: providing a substrate having a surface to be coated and producing a structured coating on the surface of the substrate to be coated by depositing at least one evaporation coating material, namely aluminium oxide, silicon dioxide, silicon nitride, or titanium dioxide, on the surface of the substrate to be coated by means of thermal evaporation of the at least one evaporation coating material and using additive structuring. The invention further relates to a coated substrate and a semi-finished product having a coated substrate.

Abstract: An arrangement including a carrier substrate, and a component situated on a cover surface of the carrier substrate in a hollow space, and electrical contacts for the component, wherein the hollow space is comprised of a plurality of spacer elements arranged on the cover surface of the carrier substrate and a cover substrate mounted on the plurality of spacer elements is provided. A semi-finished product comprising a carrier substrate made of silicon, wherein one or more recesses are formed on one side of the carrier substrate, and wherein the semi-finished product further comprises an alkaline evaporated glass applied to the side of the carrier substrate having the one or more recesses is also provided.

Abstract: The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement.

Abstract: The invention relates to a method for producing a dielectric layer (3) in an electroacoustic component (1), in particular a component operating with acoustic surface waves or bulk acoustic waves, comprising a substrate and an associated electrode structure, in which the dielectric layer (3) is formed at least in part by depositing by a thermal vapor deposition process at least one evaporation material selected from the following group of layer vaporising materials: vapor deposition glass material such as borosilicate glass, silicon nitride and aluminum oxide. The invention further relates to an electroacoustic component.

Abstract: The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement.