Abstract: An ejector for jetting droplets of viscous media onto a substrate is disclosed. The ejector comprises a jetting nozzle having a nozzle space and a nozzle outlet, and an impacting device for impacting a volume of the viscous medium in the nozzle space such that droplets of viscous medium is jetted from the nozzle space through the nozzle outlet towards the substrate. The ejector also comprise a sensor arrangement arranged after the jetting nozzle in the jetting direction, wherein the sensor arrangement is adapted to detect a jetted droplet of viscous medium passing thereby.

Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

Abstract: A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.

Abstract: An apparatus for depositing and/or jetting viscous medium on a surface of a workpiece includes at least two depositing head assemblies. The at least two depositing head assemblies are configured to move in three dimensional space. The at least two depositing head assemblies are also configured to at least one of concurrently and simultaneously deposit the viscous medium on the workpiece.

Abstract: The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.

Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.

Abstract: In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material at an edge of the first surface of the workpiece. At least a portion of the single continuous mass of material extends past the edge of the first surface and adheres to a second surface of the workpiece.

Abstract: In a method for patterning a workpiece provided with dies in a direct write machine, pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.

Abstract: The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a patterning sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.

Abstract: The present disclosure relates to the re-sampling of pixel data, with one application being micro-lithography. In particular, it relates to a first pixel map, including a plurality of white, black and grey scale pixels and gradient directions for one or more of the grey scale pixels, that is resampled to produce a second pixel map using edge geometry data generated from the gradient directions and grey scale values.

Abstract: The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a patterning sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.

Abstract: In a method for generating a pattern on a workpiece having at least one die placed thereon, positions of the at least one die and at least two global alignment marks on the workpiece are measured, pattern adjustment data is generated, pattern image data associated with the pattern to be written is adjusted based on the generated pattern adjustment data, and the pattern is generated on the workpiece based on the modified pattern adjustment data.

Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

Abstract: A method of patterning a plurality of layers of a work piece in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers and layers of the workpiece having one or a plurality of boundary condition(s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.

Abstract: The present disclosure relates to the re-sampling of pixel data, with one application being micro-lithography. In particular, it relates to the extraction of modulator pixels from a rasterized image, as a function of how the modulator moves across the rasterized image.

Abstract: An alignment method for the of patterning a work piece in a direct write machine, wherein a reference board provided with board reference features is used to coordinate calibration of a measurement station and a writing station against a common reference. An adjusted pattern is for writing on the work piece is calculated relative to the position of the reference board.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.