Abstract: A jetting device and a method of jetting droplets of viscous medium onto a substrate. The jetting device includes a jetting outlet through which the droplets are jetted. The jetting device further includes a wall located at the jetting outlet, downstream of the jetting outlet seen in the jetting direction. The wall is provided with an orifice through which jetted droplets are permitted to pass through. A gaseous flow is provided within the space past the jetting outlet such that an adverse effect on the performance of the jetting device is prevented, the adverse effect resulting from the accumulation of viscous medium residue at the jetting outlet.

Abstract: This invention relates to a device for jetting droplets of a particle filled viscous medium. The device has a nozzle, an eject mechanism connected to the nozzle, a medium feeding mechanism connected to the eject mechanism, a particle filled viscous medium container connected to the medium feeding mechanism, and a filter arranged between an outlet of the particle filled viscous medium container and the medium feeding mechanism.

Abstract: A method and a corresponding device for determining nominal mechanical data for an electronic device by automatic image processing of a digital image of a specimen of said electronic device. In the method, an object in said digital image, which object corresponds to said specimen, is identified and appearance data for the appearance of the identified object are determined. Then, at least some of the determined appearance data are compared with a stored set of nominal appearance data, which nominal appearance data are based on a prior knowledge of appearances of electronic devices, and at least some nominal appearance data of the set of nominal appearance data are selected. Finally, the nominal mechanical data of the electronic device is determined in accordance with the selected nominal appearance data and at least some of the determined appearance data.

Abstract: A method of exposing components, which are carried by a carrier tape (2), arranged in sequence along the carrier tape (2) and covered by a cover (3). The cover is attached to the carrier tape having a lower surface facing the sequence of components. The method is performed by, while feeding the carrier tape towards the picking position, separating a first portion of the cover from a first portion (31) of the carrier tape. Thereafter, guiding a thus loosened portion of the cover towards the second side of the carrier tape. Performing said guiding such that before reaching the picking position, while being raised to an upright position, the cover is automatically gathered by being folded, so that at least two portions of the lower surface of the cover face each other, thereby reducing the height of the cover.

Abstract: A method for generating data for a jetting program, includes the steps of: a) obtaining substrate data for a substrate, which is to be provided with deposits and components; and b) for each component which is to be placed on the substrate:—fetching component data for the component from said substrate data; and—selecting a matching predefined deposit pattern, comprising at least one deposit, which matches a desired deposit pattern for said component data, wherein the deposit pattern comprises, for the/each deposit, deposit data comprising deposit extension and deposit position; or—if no matching predefined deposit pattern exists, defining a deposit pattern, comprising at least one deposit, for the component data, comprising the step of defining, for the/each deposit, deposit data, which step comprises determining deposit extension and deposit position.

Abstract: System, jetting assembly and method for jetting viscous medium onto a substrate. The system comprises a plurality of ejector devices for jetting individual droplets of viscous medium onto the substrate, a plurality of viscous medium containers for holding and providing the viscous medium to be jetted, at least one holder for holding containers and ejector devices in a jetting machine, and a jetting machine.

Abstract: A method improves the performance of a jetting assembly in an apparatus for jetting droplets of viscous medium on the fly onto a substrate. The jetting assembly is releasably mounted in the apparatus and includes a nozzle, an ejection mechanism connected to the nozzle, and a viscous medium container connected to the eject mechanism. Information relating to an XY-position and a Z-position is obtained together with information regarding the exit velocity a droplet of viscous medium has when it exits the nozzle. The information is used as a basis for adjusting a trigger position of the nozzle for the subsequent jetting of droplets. A jetting assembly also includes a storage device arranged to receive and hold calibration information of properties of the assembly obtained during calibration measurements.

Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.

Abstract: A component mounting machine is arranged to perform a method for handling boards in a component mounting machine includes the steps of moving a plurality of boards substantially simultaneously from a first plurality of cassettes, arranged in parallel at the machine, onto a board carrier; processing said plurality of boards by mounting components thereon; moving said plurality of boards substantially simultaneously and in parallel from the board carrier into a second plurality of board cassettes arranged in parallel at the machine and moving a next plurality of boards from said first plurality of cassettes onto the board carrier; repeating the steps of processing and moving the plurality of boards until said first plurality of cassettes are empty; and exchanging cassettes and repeating the method from step a.

Abstract: A method of transferring component tape information to a component mounting machine, a tape guide for guiding a component tape in a component mounting machine, and a tape magazine for receiving the tape guide. The tape guide is arranged for quick and ready attachment and detachment into and from the component mounting machine. The loading and/or unloading of a component tape into and from the tape guide can be performed away from the component mounting machine. The ability to be releasably mounted is achieved by providing the tape guide with a lock that enables ready and quick attachment and detachment to an interacting lock in a component mounting machine, or in a tape magazine arranged for insertion into a component mounting machine, and a guide for guiding the component tape. The tape guide further includes an identifier for holding the identity of the tape guide, which can be associated with information relating to the component tape.

Abstract: The invention relates to a method of improving the performance of a jetting assembly in an apparatus for jetting droplets of viscous medium on the fly onto a substrate. The jetting assembly is releasably mounted in the apparatus and includes a nozzle, an ejection mechanism connected to the nozzle, and a viscous medium container connect to the eject mechanism. Information relating to an XY-position and a Z-position is obtained together with information regarding the exit velocity a droplet of viscous medium has when it exits the nozzle. The information is used as a basis for adjusting a trigger position of the nozzle for the subsequent jetting of droplets. The invention also concerns such a jetting assembly including storage device arranged to receive and hold calibration information of properties of the assembly obtained during calibration measurements.

Abstract: System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides.

Abstract: A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.

Abstract: A method, a system and an arrangement for handling component tapes in connection with mounting components onto circuit boards in a component mounting machine are disclosed, which utilizes a carrier for carrying component tapes. Each component tape is held by a component tape reel. The component mounting machine utilizes component magazines from which components, carried by the component tape, are supplied for use in a mounting process of the component mounting machine. The component tape of each component tape reel is loaded into a tape guide for guiding the component tape in the component mounting machine, and the component tape reels are arranged in the carrier, which thereaft is placed in the magazine. The tape guides are then mounted in the magazine such that the component tape loaded therein may interact with feeding devices provided in the magazine. Thereby, the magazine is loaded with components and prepared for the ensuing mounting process.

Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides.

Abstract: A method of transferring component tape information to a component mounting machine, a tape guide for guiding a component tape in a component mounting machine, and a tape magazine for receiving the tape guide. The tape guide is arranged for quick and ready attachment and detachment into and from the component mounting machine. The loading and/or unloading of a component tape into and from the tape guide can be performed away from the component mounting machine. The ability to be releasably mounted is achieved by providing the tape guide with a lock that enables ready and quick attachment and detachment to an interacting lock in a component mounting machine, or in a tape magazine arranged for insertion into a component mounting machine, and a guide for guiding the component tape. The tape guide further includes an identifier for holding the identity of the tape guide, which can be associated with information relating to the component tape.

Abstract: A method and means for exposing components (13) positioned in sequence in a carrier tape (7) and covered by a cover tape (8), in order to release and lift the cover tape from the carrier tape and expose the components in a picking position (12) for subsequent picking by a pick-up head in a component mounting machine. Comprising steps and means for continuously directing and discharging any released debris such that accumulation of debris is prevented.