Abstract: A prober capable of enhancing accuracy of a test intended. The prober includes prober needles arranged so as to be kept contacted with a laminate formed by laminating thermal transfer regulating members on each other and provided on a probe card. Such arrangement of the laminate restrains heat of the probe card from being transmitted through the probe needles to devices on a semiconductor wafer which is a specimen to be tested.

Abstract: A low-temperature test equipment capable of monitoring a test under vacuum and low temperature or ultra-low temperature conditions. The test equipment includes plural CCD cameras so arranged that plane positions thereof are rendered different from each other, as well as a prism mechanism constructed and arranged so as to permit any of the cameras to photograph a surface of a semiconductor wafer and/or a range of at least a part of probe needles of a prober. This permits a test for the wafer by the prober under vacuum and low temperature or ultra-low temperature conditions to be monitored. Also, it facilitates positional registration between the probe needles and the wafer and ensures an increase in accuracy of the test. In addition, when the low-temperature test equipment is configured so as to carry out the test in a continuous manner, full automation of the test may be realized.

Abstract: A low-temperature test equipment capable of monitoring a test under vacuum and low temperature or ultra-low temperature conditions. The test equipment includes plural CCD cameras so arranged that plane positions thereof are rendered different from each other, as well as a prism mechanism constructed and arranged so as to permit any of the cameras to photograph a surface of a semiconductor wafer and/or a range of at least a part of probe needles of a prober. This permits a test for the wafer by the prober under vacuum and low temperature or ultra-low temperature conditions to be monitored. Also, it facilitates positional registration between the probe needles and the wafer and ensures an increase in accuracy of the test. In addition, when the low-temperature test equipment is configured so as to carry out the test in a continues manner, full automation of the test may be realized.

Abstract: A prober capable of enhancing accuracy of a test intended. The prober includes prober needles arranged so as to be kept contacted with a laminate formed by laminating thermal transfer regulating members on each other and provided on a probe card. Such arrangement of the laminate restrains heat of the probe card from being transmitted through the probe needles to devices on a semiconductor wafer which is a specimen to be tested.

Abstract: A testing equipment having a refrigerator incorporated therein which is capable of accomplishing a test for electrical characteristics of a tested object under stable circumstances substantially free from any vibration. A refrigerator and a counter balance put on a floor are connected together through a rigid structure of increased strength, to thereby minimize vibration of the refrigerator. Vibration-proof pads are arranged between the counter balance and the floor. Also, Rubber dampers are arranged between a frame and an upper wall plate. Further, vibration-proof pads are arranged between the frame and the floor. Such arrangement of the pads and dampers substantially prevents transmission of vibration of the refrigerator to both a prober actuation unit and a tested object holder.

Abstract: A method of protecting eyes from welding rays in arc welding and an apparatus therefor are disclosed which are capable of closing a filter plate over a period from right before the generation of arc welding rays to the termination of the generation to fully intercept the rays, to thereby effectively protect the eyes of an operator from the rays. The invention is constructed in a manner such that a controller carries out the on-off control of a voltage applied from a filter power source to a PLZT filter plate depending upon a signal supplied from a detection circuit thereto when the detection circuit detects a built-up current occurring in a welding current, to thereby carry out the actuation of the filter plate.