Abstract: A package structure that includes a first redistribution structure and a second redistribution structure is provided. The first redistribution structure includes a first dielectric layer, and a first redistribution circuit in the first dielectric layer. The second redistribution structure includes a first portion on the first redistribution structure and a second portion on the first portion, and each of the portions is electrically connected to the first redistribution structure and the first portion, respectively. The circuit density of the second portion is lower than that of the first portion. The first portion includes a second dielectric layer having a second redistribution circuit therein. The second portion includes a third dielectric layer having a third redistribution circuit therein. The third dielectric layer has a stiffener layer, which is separated from the third redistribution circuit by the third dielectric layer. A method of forming a package structure is also provided.

Abstract: A fuel cell module includes an anode flow board, a cathode board, an intermediate adhesive layer, a membrane electrode assembly (MEA) including a membrane edge, and a leak-proof adhesive layer mounted on the membrane edge, thereby preventing contact between the intermediate adhesive layer and the membrane edge. The adhesive ability of the leak-proof adhesive layer to the membrane edge is higher than that of the intermediate adhesive layer to the membrane edge. Therefore, the methanol leakage from the membrane can be avoided.

Abstract: A wave-shaped flow board suitable for a fuel cell includes an injection-molded body substrate, a reaction zone recessed into a surface of the body substrate, and a wave-shaped current collector, which defines a plurality of independent fuel channels. The wave-shaped current collector is integrally mounted in the reaction zone and comprises a bendable conductive lug portion for providing an electrical connection between the wave-shaped current collector and a circuit on the surface of the wave-shaped flow board.

Abstract: A flow board suited for fuel cell applications. The flow board includes a body substrate formed by injection molding methods, which is resistive to methanol or chemical corrosion and has superior mechanical properties. The flow board further includes a wave-shaped reaction zone having thereon a plurality of independent fuel channels. The body substrate and the wave-shaped reaction zone may be monolithic. Alternatively, a punched electrode plate affixed on the reaction zone may define the plurality of independent fuel channels.

Abstract: A structure of an integrated packed fuel cell including an integrated cathode electrode sheet that further includes a substrate, at least a cathode electrode area, and at least a conductive opening, an intermediate bonding layer that further includes at least a bonding sheet and at least a conductive opening, an integrated anode electrode sheet that further includes a substrate, at least an anode electrode area, at least a conductive pad, a device combination, and a fuel container base.

Abstract: A novel flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode plate, a membrane electrode assembly (MEA) unit, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container. The integrated cathode and anode electrode plates are manufactured by using PCB compatible processes. The integrated cathode and anode electrode plates have embedded metal layout and improved heat dissipation capability.

Abstract: A fuel cell module includes a cathode board, an integral flow board integrated with a plurality of wave-shaped anode plates and membrane electrode assembly (MEA) interposed between the cathode board and the integral flow board. The integral flow board has a body substrate that is formed of ejection moldable polymers by using ejection-molding techniques. The wave-shaped anode plate defines a plurality of independent flow channels and is fittingly affixed in corresponding reaction zone of the body substrate.

Abstract: A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxes has a first probe region and second probe region. A single set of resistance test loop is disposed within the first probe region. Four sets of resistance test loops are disposed within the second probe region. A frying probe tester is used to probe the set of resistance test loops respectively for abstracting the production information recorded in the working zone.

Abstract: A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode sheet; a membrane electrode assembly (MEA) unit; an intermediate bonding layer; an integrated anode electrode sheet; and a fuel container. The fabrication of the integrated cathode/anode electrode sheets is compatible with printed circuit board (PCB) processes.

Abstract: A flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode sheet, a set of membrane electrode assemblies, an intermediate bonding layer, an integrated anode electrode sheet, and a fuel container base. The integrated cathode/anode electrode sheets are manufactured by using PCB compatible processes.

Abstract: A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode plate, a set of membrane electrode assemblies, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container base. The integrated cathode/anode electrode plates are conducive to mass production, and are manufactured by using PCB compatible processes.

Abstract: A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a second metal foil laminated on a second side of the dielectric interposer. A recessed cavity is etched into the second metal foil and the dielectric interposer with a portion of the first metal foil as its bottom. A die is mounted within the recessed cavity and makes thermal contact with the first metal foil. A build-up material layer covers the second metal foil and an active surface of the die. The build-up material layer also fills the gap between the die and the dielectric interposer. At least one interconnection layer is provided on the build-up material layer and is electrically connected with a bonding pad disposed on the active surface of the die via a plated through hole.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.

Abstract: A flat panel DMFC (direct methanol fuel cell) includes a first electrode plate, a set of membrane assemblies, at least a bonding sheet, a second electrode, and fuel container base. Because of the gap between the first/second electrode plates and the membrane assembly when they are laminated, the present invention provides a method to improve the contact between the first/second electrode plates and the membrane assembly.

Abstract: A prepreg for fuel cell obtained by soaking reinforcing glass fiber cloth in resin mixture and having the soaked cloth pre-dried to form incompletely cured prepreg which can be press-cured under temperature range of 60?˜200? to provide good mechanical and electrical property and high bonding strength, and when applied to fuel cell for bonding together the parts and components of the fuel cell the prepreg can also provide the effect of preventing crossover of fuel of the fuel cell and helping to the normal operation of the fuel cell.

Abstract: A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The bipolar/MEA assembly is formed by laminating the releasable bipolar, the MEA, and the bonding sheet, peeling off the release carrier, and printing a carbon ink or plating Au.

Abstract: A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.

Abstract: A method for making a packaging substrate is provided. A thin copper seed layer is formed on a carrier plate. A first resist layer is coated on the thin copper seed layer. The first resist layer defines a wire layout of copper plating area. A layer of copper is then electroplated on the copper plating area to form the wire layout. After this, the first resist layer is stripped to expose the wire layout and the thin copper seed layer. A patterned second resist layer is formed on the wire layout. The patterned second resist layer defines the Ni/Au plating area of the wire layout. The copper seed layer that is not covered by the second resist layer is etched away. A third resist layer is stacked on the second resist layer and defines an Au-plating area of the I/O fingers. Using the third resist layer as a plating hard mask, a layer of Ni/Au layer is plated on the exposed area of the wires. After this step, the second and third resist layers are removed.