Abstract: The invention relates to a plasmid, a DNA assembly method and its application recombinant strain. The plasmid has single adjacent Type IIP and Type IIS RE recognition sites. The plasmid combines the properties of Type IIP and Type IIS REs to achieve recursive cycling, SCAR-free and repeat sequence assembly.
Type:
Grant
Filed:
December 23, 2019
Date of Patent:
March 7, 2023
Assignee:
NANJING ZHONGKEYOUZI INSTITUTE OF BIOTECHNOLOGY CO., LTD
Inventors:
Shuwen Liu, Tingyi Wen, Yun Zhang, Aihua Deng