Patents Assigned to Nanofoil Corporation
  • Patent number: 8882301
    Abstract: A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: November 11, 2014
    Assignee: NanoFoil Corporation
    Inventors: David Van Heerden, Ramzi Vincent, Timothy Ryan Rude
  • Patent number: 8336457
    Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: December 25, 2012
    Assignee: Nanofoil Corporation
    Inventors: Timothy P. Weihs, Etienne Besnoin, Ramzi Vincent, Somasundaram Valliappan, Ellen Heian, David Van Heerden, Timothy Ryan Rude, Omar Knio, Ronald Spraker, Yuping Lin
  • Patent number: 7810704
    Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: October 12, 2010
    Assignee: Nanofoil Corporation
    Inventors: Alan Duckham, Jesse E. Newson, Michael V. Brown, Timothy Ryan Rude, Omar M. Knio, Ellen M. Heian, Jai S. Subramanian