Abstract: An image sensor integrated circuit may contain image sensor pixels. A channel for receiving a fluid with samples may be formed on top of the image sensor. The image sensor pixels may form light sensors and imagers. The imagers may gather images of the samples as the fluid passes over the imagers or when the samples from the fluid adhere to the surface above an imager array. A protective coating may be formed on surfaces of the channel to protect the image sensor pixels and integrated circuit from potentially damaging materials in the fluid, samples, or materials provided for evaluating the samples. The protective coating may be a base-resistant material such as a silylating agent. A cover glass may be attached above the image sensor integrated circuit to form a portion of the channel. The protective coating may be formed on surfaces of the cover glass.

Abstract: A handheld diagnostic system may include a disposable sample holder for receiving and containing a biological sample and an analysis module having a chip-scale microscope. The sample holder may include a plurality of uniformly spaced tick marks. The analysis module may include a sensor for detecting the tick marks as the sample holder is inserted into the analysis module. The chip-scale microscope may include an image sensor for capturing images of the sample. Each time the sensor detects a tick mark, control circuitry may issue a control signal to the image sensor to capture an image of the biological sample. This type of automated image capture mechanism ensures that images are captured at a uniform spatial distribution even when the sample holder is inserted into the analysis module at variable speed. The analysis module may transmit sample imaging data to a portable electronic device.

Abstract: A fluid sample analyzing system may be formed from an image sensor integrated circuit substrate. A glass wafer may be used to cover a wafer of image sensors. The glass wafer and the image sensor wafer may be attached using oxide bonding. Fluid channels may be formed in a layer that is interposed between the image sensor wafer and the glass wafer. The layer may be deposited on the image sensor wafer and the glass wafer prior to oxide bonding. A spacer may be used to deliver the fluid channel layer to the image sensor wafer before the glass wafer is bonded to the image sensor wafer. The spacer may be formed from a silicon wafer. The silicon wafer may be bonded to the image sensor wafer and thinned, leaving a thin spacer wafer layer on the image sensor wafer in which fluid channels may be formed.