Abstract: A method of preparing green ceramic tapes, comprising adding to 100 parts by weight of a fine ceramic powder, 2 to 15 parts by weight, in terms of its resin content, of a binder mixture consisting of an aqueous polyurethane and a water-soluble acrylic resin, the amount of said water-soluble acrylic resin ranging from 10 to 1500 parts by weight per 100 parts by weight of said aqueous polyurethane in said binder mixture, adding a small amount of a dispersing agent to the mixture followed by a sufficient amount of water, kneading the resultant mixture for a time sufficient to prepare an aqueous slip, forming a tape in a known manner from said aqueous, and then drying the green tape obtained.

Abstract: A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate. A method of manufacturing the ceramic substrate includes adding the ceramic powder to a first mold member, pressing a force applying member into the first mold member, forming on the ceramic substrate a first and second stepped crest, sintering the ceramic substrate and grinding at least one of the first and second stepped crests so as to round the at least one of the stepped crests.

Abstract: A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate.

Abstract: Green ceramic tapes are prepared which comprise a finely divided ceramic powder and a water-compatible polyurethane resin binder. The green tapes are prepared by casting a water-based slip containing the ceramic powder and the water-compatible polyurethane resin binder in the form of the tape and then drying the formed tape. The drying is preferably conducted in two stages, in the first of which a relatively humid atmosphere is maintained.

Abstract: A casing for a semiconductor memory chip comprises a barrier intercepting a limited space that envelopes lines of vision between an exposed surface of the chip and an inside end surface of a sealing layer for hermetically sealing a cap and a base member of the casing together and at least towards which alpha particles are emitted from the sealing layer inside surface. The barrier may be made integral with a base member peripheral region having a peripheral surface to be sealed to the cap member by the sealing layer, with that mounting surface of the base member on which the chip is attached, recessed relative to the peripheral surface. The peripheral surface may be either parallel to the mounting surface or canted so that the limited space may be directed inwardly away from the mounting surface. Alternatively, the barrier may comprise a pedestal member having a surface that is an outward extension of the mounting surface, with the mounting surface protruded relative to the peripheral surface.

Abstract: A hermetic cap member of a casing for a semiconductor memory element is provided with a protection layer on a recessed surface facing the memory element. The protection layer is of at least one material which does not emit alpha particles and has a thickness sufficient to prevent alpha particles from being emitted from the cap member onto the memory element. Specifically, the protection layer may be a plate of a pertinent one of the following silicon of high purity, 42 alloy, or Kovar and is attached to the cap member by the use of an adhesive of glass frit. Alternatively, the protection layer may be made from a metallic paste of silver, silver-palladium, or gold-palladium by firing the same onto the cap member. The protection layer may also be magnesium oxide formed by the use of a plasma spray process. As a further alternative, the protection layer may consist of a plurality of materials.

Abstract: A microwave browning vessel is provided with an electroconductive film pattern comprising a plurality of, or three or four separated sections on a lower surface of a bottom wall thereof. A browning vessel is obtained which has a bottom wall of a relatively larger area of more than 550 cm.sup.2, wherein the upper surface of the bottom wall is generally uniformly heated to uniformly brown the surface of foodstaff received on the bottom wall, when the vessel is used in the microwave oven. The area of each electroconductive film sections is restricted to 250 cm.sup.2 or less, and the sum of the areas of the film sections is at least 50% of the upper surface of the bottom wall.The vessel may be provided with a plurality of legs for supporting the vessel so that the lower surface of the bottom wall is maintained at a level of 1.0-1.7 cm higher than a surface on which the vessel is placed.

Abstract: An element of a dual-in-line ceramic package such as a substrate or cover provided with a layer of sealing glass is prepared by forming powdered low-melting sealing glass into a shape conforming to that of the element, compressing and sintering the shaped powdered glass to form a solid sintered sealing glass preform, applying the preform to the surface of the element, and fusing it thereto by heating the assembly.

Abstract: A substrate assembly for a fluorescent or phosphorescent display panel comprises a layer of fired liquid gold, preferably three microns or less thick, for each of segmented display electrodes. The layer is in direct contact with an insulator substrate and with a mass of a luminescent material and may be an integral part of a lead for the electrode or electrodes. Alternatively, the layer may be formed on a resistive layer comprising powder of ruthenium (IV) oxide and formed, in turn, on the substrate with a conductive layer interposed for providing an electric connection to the lead.

Abstract: A substrate assembly for a fluorescent or phosphorescent display panel comprises segmented electrodes, for deposition thereon of masses of a fluorescent or phosphorescent material, respectively, on electroconductive leads disposed on a substrate of an electrically insulating material, such as glass or ceramics. Each segmented electrode comprises graphite powder bound into a mass by a zinc oxide containing vitreous material that does not substantially include lead. The segmented electrode may consist of an intermediate layer placed on each electroconductive lead and a segmented layer disposed on the intermediate layer.