Abstract: Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads.

Abstract: Disclosed are a filament positioning system and a filament positioning method. The filament positioning system includes a bottom plate, a first positioning regulating mechanism and a second positioning regulating mechanism, wherein the first positioning regulating mechanism is configured to conduct positioning regulation of a position of a filament seat on the bottom plate, so that filament seats of different models can be fixed to the bottom plate, and the second positioning regulating mechanism is configured to conduct positioning regulation on the filament; and a detection module configured to collect and display position information of a filament tip and the filament seat, wherein the first positioning regulating mechanism and the second positioning regulating mechanism correspondingly regulate positions of the filament seat and the filament tip according to the position information.

Abstract: Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads.

Abstract: A group of polypeptides and a complex formed by the polypeptides and human serum albumin, a method for improving the solubility of the group of polypeptides in a salt solution by combining the polypeptides with human serum albumin, a method for preparing the complex formed by the group of polypeptides and human serum albumin, and an application of the group of polypeptides and the complex formed by the polypeptides and human serum albumin in the preparation of drugs for suppressing tumor metastasis and treating leukemia are described.

Abstract: The present disclosure provides a detection system for acquiring the SPR angle, including a modulatable SPR sensor to be detected; an incident light source apparatus; a photoelectric detector; a narrowband filter system; a modulated signal source for generating an alternating current signal that is used to modulate said modulatable SPR sensor; and a data processing system for recording the corresponding relationship between the incident angle and the intensity of the filtered reflected light and further obtaining the resonance angle of said modulatable SPR sensor. The present disclosure also provides a corresponding detection method for acquiring the SPR angle.

Abstract: A sensor chip based on the WCSPR effect and an array thereof are disclosed. The sensor chip is a multilayer structure comprising a substrate, a dielectric waveguide layer (26) disposed on the substrate and a first metal layer (27) disposed on the dielectric waveguide layer (26), wherein parameters of physical properties of the dielectric waveguide layer (26) are tunable.