Abstract: A method of manufacturing an order vacancy compound (OVC) is provided. The method includes the following steps. A trivalent ion, a hexavalent ion and one of a univalent ion and a bivalent ion for an electrodeposition process are provided to form a solar energy absorbing film. The OVC is formed by performing an electrochemical etching process on the solar energy absorbing film.

Abstract: Synthetic processes for preparing luminescent iridium complexes and precursors thereof are provided. The method employs water as the reaction solvent to prepare luminescent iridium complexes in two different ways. In the first way, a precursor [Ir2(C11NR8)4I2] (Formula I) is prepared from one of IrCl3, M3IrCl6 (M=Li, Na, K) and [Ir2(C11NR8)4Cl2], and then the precursor [Ir2(C11NR8)4I2] is converted into one of the two luminescent iridium isomeric complexes [Ir(C11NR8)2(C11NR?8)] (Formula II). In the second way, a metal complex IrCl3 or M3IrCl6 (M=Li, Na, K), HC11NR8 and a base are converted selectively into one of the two iridium isomeric complexes [Ir(C11NR8)3] (Formula VIII). Herein, R and R? are defined the same as the specification.

Abstract: An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.