Patents Assigned to Navitas Co., Ltd.
  • Publication number: 20130213578
    Abstract: A sheet bonding apparatus for bonding a thermal adhesive sheet having an adhesive layer on one side thereof to a workpiece, has a close attachment apparatus for closely attaching the adhesive layer of the thermal adhesive sheet to a surface of the workpiece, and a steam supply apparatus for supplying steam to a space around the workpiece to heat the adhesive layer through a heat conduction from the steam, thereby to bond the thermal adhesive sheet to the workpiece.
    Type: Application
    Filed: March 18, 2013
    Publication date: August 22, 2013
    Applicant: NAVITAS CO., LTD.
    Inventor: NAVITAS CO., LTD.
  • Publication number: 20110206884
    Abstract: A sheet bonding method includes a closely attaching step and a steam supply step. In the closely attaching step, a thermal adhesive sheet is closely attached to the surface of a workpiece to closely attach an adhesive layer of the sheet to the surface of the workpiece. In the steam supply step, steam is supplied to the space around the workpiece so as to heat the adhesive layer by heat conduction from the steam to bond the thermal adhesive sheet to the workpiece.
    Type: Application
    Filed: September 17, 2010
    Publication date: August 25, 2011
    Applicant: NAVITAS CO., LTD.
    Inventors: Koichi Nakamura, Takashi Kawakami
  • Patent number: 6389782
    Abstract: A method and an apparatus for wrapping an elongated article with using a tranfer printing film are provided. A transfer printing film comprising a substrate film and a pattern-decorated transfer layer on the substrate film is drawn out from a roll thereof, and fed to a surface of the article which is conveyed horizontally by the convey rollers. The printing film is subject to an adhesive application during the travel to the article on the rollers. A hot melt type adhesive is employed as the adhesive, which type of adhesive can be easily regulated in thickness by an applicator. The printing film adheres to the article by the thick hot melt type adhesive to the article surface, and pressed with heat to transfer the decorated transfer layer with adhesive together integrally.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: May 21, 2002
    Assignee: Kurz Japan Limited and Navitas Co., Ltd.
    Inventors: Masaaki Kinugawa, Kazuya Sato
  • Patent number: 6090323
    Abstract: A manufacturing method and a manufacturing apparatus for a card product such as a non-contact IC card product in which a circuit sheet is coated with a synthetic resin layer, in good efficiency and with a possibility to reduce the manufacturing cost of the product. The manufacturing apparatus has fixed molds 20 and a movable mold 30 which can freely approach or alienate from the other. The movable mold 30 has a piston 33 for reciprocal sliding movement in the movable mold 30 in the direction of approach and alienation. The fixed mold 20 has an injection port 22 for injecting the molten resin, and a concave part 23 is formed on the outer peripheral part surrounding the fixed mold end part opposite to the piston 33. To this concave part 23 there can be fitted a spacer 24 having the same face as the fixed type end face 20a or a spacer for replacement 242 which is replaceable with the spacer 24, and has a projected end face 242a of a certain height from the fixed mold end face 20.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: July 18, 2000
    Assignee: Navitas Co., Ltd.
    Inventors: Hiroshi Izuhara, Daigo Tukahara