Abstract: Optical fiber preforms can comprise a glass preform structure with an inner cavity. A powder can be placed within the inner cavity having an average primary particle size of less than about one micron. The powder can be in the form of an unagglomerated particles or a powder coating with a degree of agglomeration or hard fusing ranging from none to significant amounts as long as the primary particles are visible in a micrograph. Powders can be placed within a preform structure by forming a slurry with a dispersion of submicron/nanoscale particles within a cavity within the preform. In other embodiments, a powder coating is formed within a preform structure by depositing the powder coating directly from a reaction product stream. The formation of the powder coating can be formed within the reaction chamber or outside of the reaction chamber by flowing the product particle stream through a conduit leading to the preform structure. In additional embodiments, a powder coating is placed on an insert, e.g.

Abstract: A VCSEL structure is provided. The VCSEL structure comprises a substrate consisting of a III-V material. The structure may also include one or more conducting layers positioned on said substrate. There may be void spaces positioned between portions of the conducting layers to electrically isolate the portions. A method for fabricating the VCSEL structure is also provided.

Abstract: Disclosed by way of exemplary embodiments, a 40/50/10 Gb/s Optical Transceivers/transponders which use opto-electronic components at data rates collectively that are lower than or equal to half the data rate , using two optical duobinary carriers. More specifically, the exemplary embodiments of the disclosed optical transceivers/transponders relate to a 43 Gb/s 300 pin MSA and a 43˜56 Gb/s CFP MSA module, both include a two-carrier optical transceiver and the appropriate hardware architecture and MSA standard interfaces. The two-carrier optical transceiver is composed of a pair of 10 Gb/s optical transmitters, each using band-limited duobinary modulation at 20˜28 Gb/s. The wavelength channel spacing can be as little as 19˜25 GHz. The same principle is applied to a 100 Gb/s CFP module, which is composed of four tunable 10 Gb/s optical transmitters, with the channel spacing between optical carriers up to a few nanometers.

Abstract: Nanoscale particles, particle coatings/particle arrays and corresponding consolidated materials are described based on an ability to vary the composition involving a wide range of metal and/or metalloid elements and corresponding compositions. In particular, metalloid oxides and metal-metalloid compositions are described in the form of improved nanoscale particles and coatings formed from the nanoscale particles. Compositions comprising rare earth metals and dopants/additives with rare earth metals are described. Complex compositions with a range of host compositions and dopants/additives can be formed using the approaches described herein. The particle coating can take the form of particle arrays that range from collections of disbursable primary particles to fused networks of primary particles forming channels that reflect the nanoscale of the primary particles. Suitable materials for optical applications are described along with some optical devices of interest.

Abstract: A vertical cavity laser apparatus is provided. In one embodiment, the apparatus includes an electrically responsive substrate; a support block positioned on the electrically responsive substrate; a bridge arm structure coupled to the support block, the structure having a base; a laser active area on the bridge arm structure, a tuning pad on the bridge arm structure, a laser bond pad on the bridge arm structure with traces connecting the laser bond pad to the laser active area and base. The traces are positioned and shaped to be symmetric to avoid problems due to the asymmetry of the injection current. Additionally, in this embodiment, the laser bond pad is kept at a height of the base in order to minimize device capacitance and the traces are also kept at the height of the base. Methods are also provided whereby impedance matching and high speed performance can be accomplished irregardless of the mechanical configuration of the bridge arm structure.

Abstract: A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple optical elements can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than optical elements, by stabilizing one of the optical elements in the same manner as in the case of a single optical elements, and determining power dissipated in the heaters of the remaining optical elements based on the linearized model.

Abstract: Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.

Abstract: An optical device containing a four-port optical mixer capable of distributing the optical power presented at either or both of two input ports to specified ratios in two output ports.

Abstract: Polarization dependent loss may be reduced by providing at least one dummy waveguide or at least one dummy metal structure. Polarization dependent loss may also be reduced by imposing a mechanical force on the OIC to exert mechanical stress thereby changing at least one of the birefringence and the optical axes of at least one waveguide. And polarization dependent loss may be reduced by forming a metal heater using a first set of metal deposition parameters; forming a conductive metal structure contacting the metal heater using a second set of metal deposition parameters; and selecting the first set of metal deposition parameters and the second set of metal deposition parameters to reduce stress.

Abstract: An improved electro-optical system has a planar waveguide coupled to a photodetector through a transparent substrate. The planar waveguide is within a planar optical structure that can be part of optical communication network. The photodetector is positioned to receive light that passes from the waveguide through the transparent substrate. The photodetector can be electrically coupled to electrical circuitry along the transparent substrate for connection to a electrical apparatus. Corresponding methods for forming the electro-optical structure are described. These improved electro-optical systems can be used for terminating an optical transmission system at an end user or a local network associated with a group of end users.

Abstract: Actuators facilitating mechanical beam steering for optical integrated circuits are disclosed. The mechanical beam steering can mitigate thermal sensitivity of optical circuits, for example, arrayed waveguides. Also disclosed are methods for fabricating optical integrated circuits employing actuators.

Abstract: A method, a system, and a computer program product for managing one or more electronic devices. Performance of an electronic device is monitored and presented to a user through a digital agent interface. The performance of the electronic device is controlled automatically by digital agent through the digital agent interface. The invention also enables automatic testing of the electronic device through the digital agent interface by setting up test configurations, activating test signals, and interpreting any error codes that may be generated.

Abstract: A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple optical elements can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than optical elements, by stabilizing one of the optical elements in the same manner as in the case of a single optical elements, and determining power dissipated in the heaters of the remaining optical elements based on the linearized model.

Abstract: An integrated bi-directional transceiver device for multiple wavelength optical signals that has a high level of wavelength isolation at the receivers of the device and low cross-talk of light between an external laser transmitter and the receivers. A WDM planar light wave circuit (PLC) assembly combines high spatial light confinement waveguide structures and a variable thickness dielectric wavelength selective filter (WSF) on the surface of the device to reflect a first wavelength signal and to pass a second wavelength signal. Embodiments of the invention include branching waveguide structures and folded path waveguide assemblies with multiple WSF's.

Abstract: A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, such as an arrayed waveguide grating (AWG), a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple AWG's can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than AWG's, by stabilizing one of the AWG's in the same manner as in the case of a single AWG, and determining power dissipated in the heaters of the remaining AWG's based on the linearized model.

Abstract: An optical device with a non-rectilinearly shaped optical integrated circuit over a substantially flat portion of a riser, the riser also equipped with a relief structure that is in thermal contact with a stabilizing brace that is in turn connected to two portions of the non-rectilinearly shaped optical integrated circuit. The non-rectilinearly shaped optical integrated circuit exhibits reduced center wavelength drift.

Abstract: Photosensitive optical materials are used for establishing more versatile approaches for optical device formation. In some embodiments, unpatterned light is used to shift the index-of-refraction of planar optical structures to shift the index-of-refraction of the photosensitive material to a desired value. This approach can be effective to produce cladding material with a selected index-of-refraction. In additional embodiments gradients in index-of-refraction are formed using photosensitive materials. In further embodiments, the photosensitive materials are patterned within the planar optical structure. Irradiation of the photosensitive material can selectively shift the index-of-refraction of the patterned photosensitive material. By patterning the light used to irradiate the patterned photosensitive material, different optical devices can be selectively activated within the optical structure.

Abstract: Gradient index lenses are described that are integrated within a planar optical structure. The gradient index lens is optically coupled to a planar optical waveguide. In some embodiments, the gradient index lens with variation in index-of-refraction n one dimension is within an optical fiber. The optical fiber includes cladding at least along the edges of the central plane of the gradient index lens. Methods for forming the integrated structures are described. Further optical structures involving the gradient index lenses are also described.

Abstract: A method of depositing a top clad layer for an optical waveguide of a planar lightwave circuit. A GeBPSG top clad layer for an optical waveguide structure of a planar lightwave circuit is fabricated such that the top clad layer comprises doped silica glass, wherein the dopant includes Ge (Germanium), P (Phosphorus), and B (Boron). In depositing a top clad layer for the optical waveguide, three separate doping gasses (e.g., GeH4, PH3, and B2H6) are added during the PECVD (plasma enhanced chemical vapor deposition) process to make Ge, P and B doped silica glass (GeBPSG). The ratio of the Ge, P, and B dopants is configured to reduce the formation of crystallization areas within the top clad layer and maintain a constant refractive index within the top clad layer across an anneal temperature range. A thermal anneal process for the top clad layer can be a temperature within a range of 950 C to 1050 C.

Abstract: An optical device with a non-rectilinearly shaped optical integrated circuit over a substantially flat portion of a riser, the riser also equipped with a relief structure that is in thermal contact with a stabilizing brace that is in turn connected to two portions of the non-rectilinearly shaped optical integrated circuit. The non-rectilinearly shaped optical integrated circuit exhibits reduced center wavelength drift.