Abstract: A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons.A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.
Type:
Grant
Filed:
August 15, 1994
Date of Patent:
May 23, 1995
Assignees:
Takeda Chemical Industries, Ltd., Nihon Superior Co., Ltd.
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