Abstract: This invention includes a reticle used for making a semiconductor device in a photolithography process. The reticle has a device exposure region having sides and a device pattern within an area defined by the sides, an opaque chrome region disposed adjacent to the device region, and a kerf region surrounded by the opaque chrome region, the kerf region being offset from the sides of the device exposure region by the opaque chrome region. The reticle should facilitate a double exposure method of a photolithography process by interleaving adjacent exposures of a wafer during the photolithography process, while allowing the single exposure of the respective kerfs.