Abstract: To provide low CTE and low puffing needle coke more stably while dealing with changes in the properties of a feedstock. The low CTE and low puffing needle coke is obtained by mixing and coking a needle coke main feedstock of a coal tar-based heavy oil or petroleum-based heavy oil having a weak hydrogen donating property with a PDQI value expressed by equation (1) of less than 5.0, with a secondary feedstock having a strong hydrogen donating property with a PDQI value expressed by equation (1) of 5.0 or more, and calcining the obtained raw coke. [Equation (1)] PDQI=H %×10×(HN?/H), wherein H % is a hydrogen amount (% by weight) obtained by elemental analysis, and HN?/H is a ratio of ? naphthenic hydrogen to total hydrogen measured by 1H-NMR.

Abstract: An object is to provide an epoxy resin composition which exhibits excellent tracking resistance and additionally has excellent heat resistance with a Tg of 200° C. or higher and flame retardancy. Provided is an epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8%, wherein the phosphorus-containing epoxy resin has a ratio (L/H) of 0.6 to 4.0 of the content of trinuclear bodies (L) to the content of hepta or higher nuclear bodies (H) measured by GPC, and is a product obtained from a novolac epoxy resin having an average number of functional groups (Mn/E) of 3.8 to 4.8 and a phosphorus compound represented by the following general formula (1) and/or general formula (2).

Abstract: Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass % and a proportion of the polyamide resin (B) is 10 to 50 mass % relative to a total amount of 100 mass % of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1), and a molded article manufactured therefrom is also provided.

Abstract: Provided are an epoxy resin composition and a film or a molding material. The epoxy resin composition is an epoxy resin composition including the following components A to D: component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; component B: an epoxy resin that is liquid at 30° C.; component C: a diblock copolymer having a B-M structure (where M represents a block formed of a homopolymer of methyl methacrylate or a copolymer containing at least 50 wt % of methyl methacrylate, B represents a block that is incompatible with the epoxy resins and the block M, and that has a glass transition temperature Tg of 20° C. or less, and respective blocks represented by B and M are directly bonded to each other or are linked to each other through a linking group); and component D: an amine-based curing agent that is dicyandiamide or a derivative thereof.

Abstract: The present invention has an object to provide a resin composition for fiber-reinforced composite materials that excels in rapid curability without impairing low viscosity and heat resistance. A two-component curable resin for fiber-reinforced composite materials is provided, which is configured of a base material including an epoxy resin (A) and a curing agent including an amine compound (B) selected from either norbornane diamine or triethylenetetramine and a phenol compound (C), and in which a mass ratio of the base material to the curing agent is within the range of from 90:10 to 70:30, and the phenol compound (C) includes a phenol compound including two or more phenolic hydroxyl groups and is contained at 5% by weight to 35% by weight in the curing agent. A fiber-reinforced composite material is obtained by mixing reinforcing fibers in the resin composition for fiber-reinforced composite materials.

Abstract: A support for a polymer electrolyte fuel cell catalyst satisfying the following requirements (A), (B), (C), and (D), and a producing method thereof, as well as a catalyst layer for a polymer electrolyte fuel cell and a fuel cell: (A) a specific surface area according to a BET analysis of a nitrogen adsorption isotherm is from 450 to 1500 m2/g. (B) a nitrogen adsorption and desorption isotherm forms a hysteresis loop in a range of relative pressure P/P0 of more than 0.47 but not more than 0.90, and a hysteresis loop area ?S0.47-0.9 is from 1 to 35 mL/g; (C) a relative pressure Pclose/P0 at which the hysteresis loop closes is more than 0.47 but not more than 0.70; and (D) a half-width of a G band detected by Raman spectrometry in a range of from 1500 to 1700 cm?1 is from 45 to 75 cm?1.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: Provided is an organic EL device including: a light emitting layer between an anode and a cathode facing each other, in which the light emitting layer contains a first host, a second host, and a luminescent dopant, an indolocarbazole compound represented by General Formula (1) is contained as the first host, and a biscarbazole compound or a dibenzofuran compound having a dibenzofuran or dibenzothiophene ring is contained as the second host. This organic EL device has a low drive voltage, high efficiency, and high drive stability.

Abstract: Provided is a Pd coated Cu bonding wire for a semiconductor device capable of sufficiently obtaining bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases. The bonding wire for a semiconductor device comprises a Cu alloy core material; and a Pd coating layer formed on a surface of the Cu alloy core material; and contains 0.03 to 2% by mass in total of one or more elements selected from Ni, Rh, Ir and Pd in the bonding wire and further 0.002 to 3% by mass in total of one or more elements selected from Li, Sb, Fe, Cr, Co, Zn, Ca, Mg, Pt, Sc and Y. The bonding wire can be sufficiently obtained bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases by being used.

Abstract: Provided is a thermally activated delayed fluorescence-emitting organic EL element having a low driving voltage, high luminous efficiency, and a prolonged lifespan. The organic EL element contains one or more light-emitting layers between an anode and a cathode that face each other, and at least one light-emitting layer contains a host material composed of a carbazole compound represented by formula (1) and a thermally activated delayed fluorescence material composed of an indolocarbazole compound containing an indolocarbazole ring in its molecule. Here, L1 represents an aromatic group, and at least one R1 represents a carbazolyl group, and n is 1 or 2.

Abstract: Provided is an organic EL device having a low drive voltage, high efficiency, and high drive stability, and a material for an organic electroluminescent device suitable for the organic EL device. This material for an organic EL device includes: an indolocarbazole compound represented by General Formula (1). In addition, provided is an organic electroluminescent device in which this material for an organic electroluminescent device is used as a first host and carbazole compounds are used as second hosts. Here, a ring A is a heterocyclic ring represented by Formula (Ia), L1 to L3 are a direct bond, an aromatic hydrocarbon group or an aromatic heterocyclic group, B1 to B3 represent a direct bond or a biphenyldiyl group represented by Formula (1b), and at least one of B1 to B3 is a biphenyldiyl group.

Abstract: Provided is an organic EL device having high efficiency and high driving stability despite having a low driving voltage. The organic EL device has at least one light-emitting layer that is composed of a vapor deposition layer containing a first host selected from among indolocarbazole compounds represented by General Formula (1), a second host selected from among biscarbazole compounds represented by the following General Formula (2), and a light-emitting dopant material: wherein m and n represent the number of repetitions and are an integer of 0 to 4, and m+n?2 is satisfied; Ar2 and Ar3 represent an aromatic hydrocarbon group or a group in which two or three of the aromatic hydrocarbon groups are linked, and at least one is a fused aromatic hydrocarbon group.

Abstract: A polymer for organic electroluminescent devices having high luminous efficiency and applicable to a wet process is provided. This polymer for organic electroluminescent devices is characterized in that it includes a polymer of a polyphenylene main chain represented by General Formula (1) which is used in at least one layer of an organic layer in an organic electroluminescent device formed by laminating an anode, the organic layer, and a cathode on a substrate, and which has thermally activated delayed fluorescence characteristics (TADF characteristics) (where x is a phenylene group or a linked phenylene group, L is a single bond, an aromatic hydrocarbon group, or an aromatic heterocyclic group, and A is an aromatic hydrocarbon group, an aromatic heterocyclic group, or a linked aromatic group, and satisfies S1(A)?T1(A)?0.50 (eV)).

Abstract: A resin-metal composite 100 includes resin particles 10 and metal particles 20. The metal particles 20 are dispersed or immobilized on the resin particles 10, and portions of the metal particles 20 are three-dimensionally distributed in a surface section 60 of the resin particles 10. The metal particles 20 include encased metal particles 30 completely encased in the resin particles 10, partially exposed metal particles 40 having a portion embedded in a resin particle 10 and a portion exposed from the resin particle 10, and surface-adsorbed metal particles 50 absorbed on the surface of a resin particle 10.

Abstract: This resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular weight of 4,000 or more, and a phenoxy resin, and the second resin is a polycarbonate resin. The content ratio, by weight, of the first resin to the second resin (the first resin:the second resin) is preferably in the range of 9:1 to 2:8. Both the first resin and the second resin preferably have a bisphenol skeleton in a molecule.

Abstract: Provided are an organic EL device having high luminous efficiency and a prolonged lifespan with a low driving voltage, and a melt mixture for an organic electroluminescent device used in the organic EL device. The melt mixture for an organic electroluminescent device is a melt mixture of at least two types of organic compounds including a first organic compound and a second organic compound, and a difference in vapor deposition temperature between the first organic compound and the second organic compound is 20° C. or less, and a difference between a PL maximum emission wavelength of the melt mixture and a PL maximum emission wavelength of any of the first organic compound and the second organic compound is within ±10 nm. The melt mixture is suitable as a host material of a light-emitting layer.

Abstract: Provided is a method for manufacturing a high-density artificial graphite electrode without substantially changing a particle size or a proportion of needle coke used, increasing an amount of binder pitch, or performing extrusion molding at a high molding pressure. The method for manufacturing a high-density artificial graphite electrode is kneading binder pitch into needle coke, performing extrusion molding thereof, and then calcining and graphitizing thereof, wherein needle coke obtained by performing coke shape changing treatment for at least some of pulverized needle coke to be used, thereby increasing a ratio of an enveloping perimeter/a perimeter by 1% or more as compared with a value before the changing is used. Here, the enveloping perimeter is a length of a perimeter when apexes of convex portions of the pulverized needle coke are connected to each other via the shortest distance, and the perimeter is a length of a perimeter of a particle.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: The present invention has as its object the provision of a bonding wire for semiconductor devices mainly comprised of Ag, in which bonding wire for semiconductor devices, the bond reliability demanded for high density mounting is secured and simultaneously a sufficient, stable bond strength is realized at a ball bond, no neck damage occurs even in a low loop, the leaning characteristic is excellent, and the FAB shape is excellent. To solve this problem, the bonding wire for semiconductor devices according to the present invention contains one or more of Be, B, P, Ca, Y, La, and Ce in a total of 0.031 at % to obtain a 0.180 at %, further contains one or more of In, Ga, and Cd in a total of 0.05 at % to 5.00 at %, and has a balance of Ag and unavoidable impurities.

Abstract: A resin composition for a fiber-reinforced composite material that makes it possible to improve productivity by suppressing deformation at the time of removal from a mold, in particular, in the PCM method, while achieving both rapid curing and storage stability. The resin composition for a fiber-reinforced composite material includes an epoxy resin (A) including a phenol novolac epoxy resin and a bisphenol A epoxy resin; a phenoxy resin (B); dicyandiamide (C); an imidazole-based curing aid (D); and a phenol-based curing accelerator (E) as essential components, wherein the phenol novolac epoxy resin of the epoxy resin (A) constitutes 40 parts by mass to 75 parts by mass, the bisphenol A epoxy resin constitutes 10 parts by mass to 35 parts by mass, and the phenoxy resin (B) constitutes 5 parts by mass to 15 parts by mass in the total of 100 parts by mass of the components (A) to (E).