Patents Assigned to Nippon Valqua Industries, Ltd.
  • Patent number: 7011312
    Abstract: To provide a novel gland packing and a sealing apparatus comprising this, wherein the gland packing displays high and stable sealability for a stem and an inner wall surface of a stuffing box even for uses further requesting the movability (rotation and reciprocating movement), and further, gives excellent effects, such as decrease of moving resistance of a stem, shape stability, adaptability to a corroded and worn-out stem and stuffing box, function for receiving shafts, easiness of equipment, simplification of sealing structure, and compactness of a sealing apparatus.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: March 14, 2006
    Assignee: Nippon Valqua Industries, Ltd.
    Inventor: Makoto Ishida
  • Patent number: 7004474
    Abstract: A seal for an endless track has a cross section having a centerline parallel to an axis of the seal and a configuration symmetric with respect to the centerline of the cross section. The seal can include an elastically deformably configured portion having a cross section like alphabetical letter X, and a protrusion extending from an intersection of legs of letter X in a bushing-side direction further than a plane connecting bushing-side end portions of the legs of letter X. The protrusion has an end surface where the protrusion contacts the bushing. The seal can further include an embedding portion embedded in a space between legs of letter X, on a bushing-side of the intersection of the legs of letter X.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: February 28, 2006
    Assignees: Topy Kogyo Kabushiki Kaisha, Nippon Valqua Industries, Ltd.
    Inventors: Kenichi Takahashi, Masaki Ohara, Akiyoshi Kurihara, Seiji Oomura, Noriyuki Andou, Takashi Konno, Hiromasa Muraki, Akira Muramatsu, Shunsuke Tanaka, Kouji Toriyama
  • Publication number: 20060041069
    Abstract: The present invention provides: a first sealing material for semiconductor device which sealing material is excellent in plasma resistance and inexpensive; and a second sealing material for semiconductor device and a method of manufacturing this sealing material wherein the sealing material has a good surface smoothness and a good dimensional precision. The first sealing material contains a fluororubber as a rubber component wherein the fluororubber inevitably contains a cured product of a fluorine-based elastic copolymer of a specific composition. The second sealing material is obtained by crosslinking, with ionizing radiation, a fluororubber preform containing a fluororubber component (a) (comprising a specific fluorine-based elastic copolymer) and a non-elastic fluororesin component (b) (comprising a vinylidene fluoride (co)polymer) in a specific ratio.
    Type: Application
    Filed: October 9, 2003
    Publication date: February 23, 2006
    Applicants: Asahi Glass Co., LTD., Nippon Valqua Industries, Ltd.
    Inventors: Naoko Sumi, Hiroki Kamiya, Masanori Okazaki, Yukio Kobayashi, Yoshitaka Samura
  • Publication number: 20060012126
    Abstract: A gland packing characterized in that a water swelling mineral is stuck or impregnated into a surface or an inner part of a gland packing base material. The water swelling mineral is preferably water swelling mica. This gland packing substantially eliminates seizing and can exhibit an excellent sealing property even if the amount of leakage of an internal fluid or injected fluid for a lubrication on a sliding surface is lessened as compared with a conventional example.
    Type: Application
    Filed: November 20, 2003
    Publication date: January 19, 2006
    Applicant: NIPPON VALQUA INDUSTRIES LTD.
    Inventors: Makoto Ishida, Kazumasa Takiteru
  • Patent number: 6783129
    Abstract: A seal device (31) for a bearing system (21) is constituted by first and second seal rings (32) and (35). The first seal ring (32) is constituted by a lip seal (33) having a lip portion (33B) in sliding contact with an end face (23B) of a bush (23) which is fitted on a joint shaft (26), and a slide tube (34) having a seal surface (34C) on an end face at an axial end away from the lip portion (33B) which is formed integrally with a tubular body portion (33A) of the lip seal (33). The second seal ring (35) is fixedly fitted in a boss (22) radially on the outer side of the first seal ring (32), and provided with a seal surface (35D) on the inner side of an annular inward collar portion (35C) for sliding contact with the seal surface (34C) of the slide tube (34).
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: August 31, 2004
    Assignees: Hitachi Construction Machinery Co., Ltd., Nippon Valqua Industries, Ltd.
    Inventors: Hideki Akita, Ryohei Suzuki, Osamu Gokita, Tatsuo Takamure, Hiromasa Muraki, Noriyuki Ando
  • Publication number: 20040007833
    Abstract: A seal for an endless track has a cross section having a centerline parallel to an axis of the seal and a configuration symmetric with respect to the centerline of the cross section. The seal can include an elastically deformably configured portion having a cross section like alphabetical letter X, and a protrusion extending from an intersection of legs of letter X in a bushing-side direction further than a plane connecting bushing-side end portions of the legs of letter X. The protrusion has an end surface where the protrusion contacts the bushing. The seal can further include an embedding portion embedded in a space between legs of letter X, on a bushing-side of the intersection of the legs of letter X.
    Type: Application
    Filed: June 25, 2003
    Publication date: January 15, 2004
    Applicants: TOPY KOGYO KABUSHIKI KAISHA, NIPPON VALQUA INDUSTRIES, LTD.
    Inventors: Kenichi Takahashi, Masaki Ohara, Akiyoshi Kurihara, Seiji Oomura, Noriyuki Andou, Takashi Konno, Hiromasa Muraki, Akira Muramatsu, Shunsuke Tanaka, Kouji Toriyama
  • Patent number: 6019621
    Abstract: A highly lubricative sound-absorbing material is produced inexpensively and attenuates sliding noise and vibration noise. The highly lubricative sound-absorbing material comprises a rubber sheet (21) and a highly lubricative coating layer (22) formed directly on a surface of the rubber sheet by coating the surface with a mixture of an adhesive and a fluororesin system coating agent such as an polytetrafluoroethylene resin or the like by a thickness of 1 to 10 .mu.m. The rubber sheet (21) is formed into an annular shape and coated on its surface with the highly lubricative sound-absorbing layer (22) having a thickness of 1 to 10 .mu.m, preferably 3 .mu.m. The rubber sheet (21) is attached to a surface of a cable reel on which a flat cable slides.
    Type: Grant
    Filed: December 10, 1997
    Date of Patent: February 1, 2000
    Assignees: Sumitomo Wiring Systems, Ltd, Nippon Valqua Industries, Ltd.
    Inventors: Shoichi Sugata, Yoshihiro Tsujita
  • Patent number: 5510176
    Abstract: The polytetrafluoroethylene (PTFE) porous film of the invention is characterized in that the film is formed from a PTFE resin molding powder obtained by suspension polymerization and has a porosity of 40 to 80%, and removal ratio of uniform particle having a 0.2 .mu.m diameter of less than 99% or bubble point of not less than 3 kg/cm.sup.2. This PTFE porous film is obtained by a process of compression-molding a PTFE resin molding powder to prepare a preform, sintering the preform at a temperature not lower than its melting point, processing the preform into films, then laminating at least two of the obtained films, fusing the films to unite them, and subjecting the obtained film to uniaxial or biaxial stretching at a temperature not higher than the melting point of PTFE. If desired, the finally obtained film may be subjected to heat setting. In the PTFE porous film of the invention, pores are nearly round and the diameters of the pores are almost uniform.
    Type: Grant
    Filed: August 26, 1994
    Date of Patent: April 23, 1996
    Assignees: Mitsubishi Kasei Corporation, Nippon Valqua Industries, Ltd.
    Inventors: Atsushi Nakamura, Satoshi Nakashima
  • Patent number: 5469128
    Abstract: A circuit element for microwave and millimeter-wave bands and a method of producing the same. A dielectric line is made of a pure dielectric resin. A high-frequency wave absorbing member is made of a pure dielectric resin containing at least one of first, second and third powders dispersed therein. The first powder having a high specific inductive capacity, the second powder having a high magnetic permeability, and the third powder having a high specific resistance. A compression molding technique is used to fusion bond the high-frequency wave absorbing member to the dielectric line.
    Type: Grant
    Filed: September 14, 1994
    Date of Patent: November 21, 1995
    Assignees: Nissan Motor Co., Ltd., Nippon Valqua Industries, Ltd.
    Inventors: Umeo Kawanishi, Nobuhisa Hirayama, Takeshi Hamabe, Toru Takagi
  • Patent number: 5397418
    Abstract: A method of fusion bonding of a mark plate places a mark plate, having a heat-melt portion formed on at least a part of a front surface-outer peripheral portion, a side surface and a back surface-outer peripheral portion, the heat-melt portion being made of a thermoplastic resin 6, into a recess portion provided on a surface of a wall plate. A peripheral portion of the mark plate is heated to a temperature not lower than the melting point of the thermoplastic resin from the front surface side of the wall plate by a front surface side heater, e.g. a heating platen 7, while heating the peripheral portion of the mark plate to a temperature not higher than the melting point of the wall plate from the back surface side of the wall plate by a back surface side heater, e.g. another heating platen.
    Type: Grant
    Filed: December 2, 1993
    Date of Patent: March 14, 1995
    Assignee: Nippon Valqua Industries, Ltd.
    Inventors: Kenji Shimizu, Atsushi Nobe, Kenichi Yamada
  • Patent number: 5358678
    Abstract: A polytetrafluoroethylene (PTFE) porous film is formed from a PTFE resin molding powder obtained by suspension polymerization. The film has a porosity of 40 to 80% and a removal ratio of uniform particles having a diameter of 0.2 .mu.m less than 99%, or has a porosity of 40 to 80% and a bubble point of not less than 3 kg/cm.sup.2. This PTFE porous film is obtained by a process of compression-molding a PTFE resin molding powder to prepare a preform, sintering the preform at a temperature not lower than the melting point of the unsintered PTFE, processing the preform into films, then laminating at least two of the obtained films, fusing the films to unite them, and subjecting the obtained film to uniaxial or biaxial stretching at a temperature not higher than a melting point of the sintered PTFE. If desired, the finally obtained film may be subjected to heat setting. In the PTFE porous film of the invention, pores are nearly round and the diameters of the pores are almost uniform.
    Type: Grant
    Filed: July 6, 1992
    Date of Patent: October 25, 1994
    Assignees: Mitsubishi Kasei Corporation, Nippon Valqua Industries, Ltd.
    Inventors: Atsushi Nakamura, Satoshi Nakashima
  • Patent number: 5110526
    Abstract: In accordance with the present invention, there is provided a process for producing polytetrafluoroethylene (PTFE) resin molded articles, wherein an unsintered PTFE resin paste extrusion molded article as extruded from an extrusion machine and inserted into a sintering mold having an inside diameter slightly larger than an outside diameter of said unsintered PTFE resin molded article is sintered at a temperature higher than a melting point of the PTFE resin. In another aspect of the invention, PTFE resin molded articles are produced by a process wherein an unsintered PTFE resin paste extrusion molded article immediately after being extruded from an extrusion machine is sized by means of a sizing die, and the unsintered PTFE molded article thus sized is inserted into a sintering mold having an inside diameter slightly larger than an outside diameter of said unsintered molded article, followed by sintering at a temperature higher than a melting point of the PTFE resin.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: May 5, 1992
    Assignee: Nippon Valqua Industries, Ltd.
    Inventors: Taira Hayashi, Hiroyuki Watanabe, Akira Tuchiya, Kazuo Hagiwara, Iwao Hishiyama
  • Patent number: 5102861
    Abstract: Improvement in the superconducting transition temperature of superconductive materials which have perovskite structure or similar structure to perovskite such as typically Y-Ba-Cu-O type perovskite compounds is obtained by implanting phosphorus ion in the superconductive materials.
    Type: Grant
    Filed: June 7, 1990
    Date of Patent: April 7, 1992
    Assignee: Nippon Valqua Industries, Ltd.
    Inventor: Kohzoh Masuda
  • Patent number: 4950530
    Abstract: In a generally annular clutch facing comprising a fibrous substrate embedded in a matrix of a cross-linked polymeric binder, the improvement in which said fibrous substrate comprises 100 parts by weight of rock wool, from 10 to 50 parts by weight of organic fiber and from 5 to 50 parts by weight of glass fiber in the form of yarn, roving, strand or code, or in the form of fabric made of such yarn, roving, strand or code, and in a generally annular clutch facing comprising a fibrous substrate in the form of woven fabric embedded in a matrix of a cross-linked polymeric binder with warp yarns of the fabric extending circumferentially of the clutch facing, the improvement in which the warp yarns of the fabric contain glass fiber, and weft yarns of the fabric contain rock wool. The clutch facings according to the invention have great tensile strength, and do not suffer from a problem of judder which is felt by a driver as vibration during operation.
    Type: Grant
    Filed: June 24, 1988
    Date of Patent: August 21, 1990
    Assignee: Nippon Valqua Industries, Ltd.
    Inventor: Kenji Shibatani