Abstract: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

Abstract: A die-casting method that eliminates the need to inject insulation. By injecting molten metal sufficiently quickly after injecting tip lubricant, die-cast products may be removed from the mold even without injecting isulation. To this end, a movable die may at least begin moving toward a fixed die before tip lubricant is injected. The tip lubricant may be injected from a molten metal pouring port in a shot sleeve or from the movable die toward the shot sleeve. Tip lubricant which has been introduced into the shot sleeve is conveyed into the die cavity by movement of the molten metal, thus coating the die cavity inner surface.