Abstract: A method for coating only the element of an electronic device such as resor, diode or the like having an attached lead or leads with a powder coating. In this method, the electronic device travels on conveying apparatus from one end to the other end thereof, the lead holding the electronic device stably thereon. The electronic device is preliminarily heated during said travel by a preheating furnace thereby partially melting the powder coating which is applied to said device in the following part of the travel, the partially stuck powder coating on said electronic device being cured by passing the device through a secondary heating furnace thereby making it possible to complete the coating of the powder coating on the electronic device.