Abstract: A semiconductor laser and a method of forming the same are provided. The n-side and p-side junctions are independently optimized to improve carrier flow. The material for the n-side cladding layer is selected to yield a small conduction to valance band gap offset ratio while the material for the p-side cladding layer is selected to yield a large conduction to valance band gap offset ratio.

Abstract: An optical source comprised of a stack of at least two laser diode subassemblies is provided. Each laser diode subassembly includes a submount and a multi-mode, single emitter laser diode. Each of the at least two laser diode subassemblies is mounted to a stepped mounting member such that the output beams from the at least two laser diode subassemblies are vertically displaced along the z-axis, horizontally displaced along the y-axis, and not horizontally displaced along the x-axis.

Abstract: A single piece optic for coupling the output of a diode laser array into an optical fiber array is provided. The coupling optic has a planar back surface which, during use with a diode laser array, is positioned substantially parallel to the front face of the laser array. The coupling optic is fabricated from a single substrate and is comprised of a plurality of optical elements. Depending upon the technique used to fabricate the optical elements, the individual optical elements may be trapezoidally-shaped or rectangularly-shaped. The front surface of each optical element is tilted, thus preventing reflected laser radiation from resonating within the diode laser's emitters. Preferably the wedge angle for the tilted front surface is greater than 2 mrad, thus accomplishing the goal of limiting feedback into the emitters, and less than 4 mrad, thus reducing beam steering.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: Method and apparatus are provided that limit the current ramp rate applied to a laser bar or a single emitter laser diode to a predetermined value of 150 milliamps per millisecond or less. In addition to the laser diode and its power supply, the apparatus includes a power supply control circuit that performs the function of limiting the power supply ramp rate. The power supply control circuit can be separate from, or integrated within, the power supply.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: A method of minimizing stress within large area semiconductor devices which utilize a GaAs substrate and one or more thick layers of AlxGa1-xAs is provided, as well as the resultant device. In general, each thick AlxGa1-xAs layer within the semiconductor structure is replaced, during the structure's fabrication, with an AlxGa1-xAszP1-z layer of approximately the same thickness and with the same concentrations of Al and Ga. The AlxGa1-xAszP1-z layer is lattice matched to the GaAs substrate by replacing a small percentage of the As in the layer with P.

Abstract: A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

Abstract: A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each submount assembly includes a submount. At least one laser diode is attached to a front portion of each submount while a spacer, preferably comprised of an electrically isolating pad and an electrical contact pad, is attached to a rear portion of each submount. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the electrical contact pad, either directly or indirectly. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

Abstract: A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each laser diode submount assembly includes a submount comprised of a non-conductive material. At least one laser diode is attached to a first portion of one surface of each submount while a spacer is attached to a second portion of the same submount surface. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. The individual laser diodes of the fabricated stack can be serially coupled together, coupled together in parallel, or individually addressable. To provide package cooling, the laser diode stack is thermally coupled to a cooling block.

Abstract: An end-pumped solid state laser utilizing a laser diode stack of laser diode subassemblies as the pump source is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode subassembly includes a submount to which one or more laser diodes are attached. The fast axis corresponding to each output beam of each laser diode is substantially perpendicular to the mounting surfaces of the submount. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.

Abstract: A side-pumped solid state laser utilizing a laser diode stack of laser diode submount assemblies is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode submount assembly includes a submount to which one or more laser diodes are attached. The radiation-emitting active layer of each laser diode is positioned substantially parallel to the mounting surfaces of the submount, causing the fast axis of each laser diode's output beam to be substantially orthogonal to the submount mounting surfaces. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly.

Abstract: A system is provided that electrically isolates a diode laser when the health of the diode laser deteriorates past a preset value. In addition to the diode laser and its power supply, the system includes a monitoring system that monitors the voltage across the diode laser and/or the voltage across a series resistor and/or the operating temperature of the diode laser and/or one or more characteristics of the output beam of the diode laser and/or the temperature of the diode laser coolant and/or the flow rate of the diode laser coolant. The system also includes a power supply controller and associated control circuit that is activated upon receipt of a trigger signal from the monitoring system.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile laser diode assembly is provided, the assembly comprised of a plurality of laser diode subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual laser diode subassembly output beams do not interfere with one another.