Abstract: Dielectrics are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. The dielectrics are annealed at temperatures allowing the use of copper foil substrates, and at low oxygen partial pressures.
Type:
Grant
Filed:
July 17, 2003
Date of Patent:
April 18, 2006
Assignees:
E. I. du Pont de Nemours and Company, Norch Carolina State University
Inventors:
William J. Borland, Jon Fredrick Ihlefeld, Angus Ian Kingon, Jon-Paul Maria