Abstract: Provided is a hot-melt pressure-sensitive adhesive composition which enables to form a pressure-sensitive adhesive layer without allowing the progression of rapid gelation at the time of heating and melting. The pressure-sensitive adhesive composition provided by the present invention is a solvent-free hot-melt pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a base polymer, an isocyanate crosslinking agent, and a tackifier T which is a reaction product of a compound X and a compound Y. A content of the tackifier T with respect to 100 parts by weight of the base polymer is 20 parts by weight or more and 40 parts by weight or less.

Abstract: The present invention relates to a battery separator including: a porous substrate; and a layer of a crosslinked polymer supported on at least one surface of the porous substrate, in which the crosslinked polymer is obtained by reacting (a) a reactive polymer having, in the molecule thereof, a reactive group containing active hydrogen with (b) a polycarbonate urethane prepolymer terminated by an isocyanate group.

Abstract: The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment.

Abstract: The present invention relates to a composition for thermosetting silicone resin including: (1) a dual-end silanol type silicone resin represented by formula (I) in which R1 represents a monovalent hydrocarbon group, and n is an integer of 20 to 10,000, provided that all R1 groups may be the same or different; (2) a trialkoxysilane; and (3) a condensation catalyst.

Abstract: The present invention relates to a permanent magnet obtained by sintering a green sheet which is produced by mixing a magnet raw material with a resin binder and molding the resulting mixture, and a method for producing the same. Since the present invention has such a constitution, the contraction due to sintering becomes uniform, whereby the deformations such as warpage and depressions do not occur after sintering. Further, it is unnecessary to perform the conventional correcting processing after sintering, which can simplify the production steps, because the pressure unevenness at the time of pressing disappears. Therefore, it becomes possible to mold the permanent magnet with a high degree of dimension accuracy. Furthermore, even when the permanent magnet is reduced in film thickness, the magnetic characteristics are not deteriorated by the processing-deteriorated layer on the surface.