Patents Assigned to NUP2 Incorporated
  • Publication number: 20040132288
    Abstract: Fabrication of microelectronic devices is accomplished using a substrate having a recessed pattern. In one approach, a master form is used to replicate a substrate having a pit pattern. In another approach, the substrate is produced by etching. A series of stacked layers having desired electrical characteristics is applied to the substrate and planarized in a manner that creates electrical devices and connections therebetween. The microelectronic devices can include a series of row and columns and are used to store data at their intersection.
    Type: Application
    Filed: June 11, 2003
    Publication date: July 8, 2004
    Applicant: NUP2 Incorporated
    Inventor: Daniel R. Shepard
  • Patent number: 6598164
    Abstract: As advances continue to be made in the area of high density data storage devices, the storage of such data as music (as is presently stored on audio CD-ROM's), books on tape, videos, movies and the like will become more common. However, when this type of information is stored digitally, the risk of data piracy will increase. What is needed is an integrated copy deterring mechanism for stored digitized information such as audio recordings and the like. The present invention is a digital data storage device which comprises one or more Digital to Analog Converters (DAC's). By incorporating Digital to Analog Converters on the chip or within the chip's packaging (a hybrid device), data being output could be made available in an analog form only (although some portion of the stored information could still be made available in a digital format). A device employing the analog output means disclosed could comprise read only data storage means or writable or one time programmable data storage means.
    Type: Grant
    Filed: April 12, 1999
    Date of Patent: July 22, 2003
    Assignee: Nüp2 Incorporated
    Inventor: Daniel Robert Shepard
  • Patent number: 6586327
    Abstract: Fabrication of microelectronic devices is accomplished using a substrate having a recessed pattern. In one approach, a master form is used to replicate a substrate having a pit pattern. In another approach, the substrate is produced by etching. A series of stacked layers having desired electrical characteristics is applied to the substrate and planarized in a manner that creates electrical devices and connections therebetween. The microelectronic devices can include a series of row and columns and are used to store data at their intersection.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: July 1, 2003
    Assignee: NUP2 Incorporated
    Inventor: Daniel R. Shepard