Abstract: The present invention provides a thermosensitive multiple recording sheet characterized in that a second base material having light transmission properties is attached to the side of a first thermosensitive recording layer of a first thermosensitive recording sheet comprising a first base material and the first thermosensitive recording layer formed on one surface of the first base material, through a temporary adhesive layer, the second base material is composed of an information disclosing portion and an information non-disclosing portion, a shielding layer is formed at the position corresponding to the information non-disclosing portion on the second base material, and an ultraviolet curable resin layer are formed as an outermost layer of the sheet.

Abstract: The present invention provides a thermosensitive multiple recording sheet characterized in that a second base material having light transmission properties is attached to the side of a first thermosensitive recording layer of a first thermosensitive recording sheet comprising a first base material and the first thermosensitive recording layer formed on one surface of the first base material, through a temporary adhesive layer, the second base material is composed of an information disclosing portion and an information non-disclosing portion, a shielding layer is formed at the position corresponding to the information non-disclosing portion on the second base material, and an ultraviolet curable resin layer are formed as an outermost layer of the sheet.

Abstract: The present invention provides a thermosensitive multiple recording sheet characterized in that a second base material having light transmission properties is attached to the side of a first thermosensitive recording layer of a first thermosensitive recording sheet comprising a first base material and the first thermosensitive recording layer formed on one surface of the first base material, through a temporary adhesive layer, the second base material is composed of an information disclosing portion and an information non-disclosing portion, a shielding layer is formed at the position corresponding to the information non-disclosing portion on the second base material, and an ultraviolet curable resin layer are formed as an outermost layer of the sheet.

Abstract: The present invention provides a thermosensitive multiple recording sheet characterized in that a second base material having light transmission properties is attached to the side of a first thermosensitive recording layer of a first thermosensitive recording sheet comprising a first base material and the first thermosensitive recording layer formed on one surface of the first base material, through a temporary adhesive layer, the second base material is composed of an information disclosing portion and an information non-disclosing portion, a shielding layer is formed at the position corresponding to the information non-disclosing portion on the second base material, and an ultraviolet curable resin layer are formed as an outermost layer of the sheet.

Abstract: A base paper for a molding container including a substrate paper having a basis weight of 100 to 500 g/m2 and overall density of 0.4 to 0.7 g/cm3 and which has a high density layer having a density of 0.7 to 0.9 g/cm3 and a low density layer having a density of less than 0.7 g/cm3; and a release agent layer which is provided on at least one surface of the substrate paper and which may be provided via an undercoat layer, wherein the low density layer is mainly constituted of at least one pulp selected from the group consisting of mechanical pulp, curled fibers, and mercerized pulp; and wherein air permeability defined in JIS-P8117 is 100 to 5000.

Abstract: The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20a formed on a tape body, and the tape body 20 includes: a first base material 21; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20a and the periphery thereof, and the adhesive in the recessed portion 20a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.