Abstract: An electroless plating bath composition for plating particulate matter is provided. The plating bath composition includes a metal-containing component and a reducing component. The particulate matter is plated with at least one metal layer including at least two metals by electroless metal deposition in order to provide cutting and grinding tools with improved wear resistance.

Abstract: An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.

Abstract: An electroless plating bath composition for plating particulate matter is provided. The plating bath composition includes a metal-containing component and a reducing component. The particulate matter is plated with at least one metal layer including at least two metals by electroless metal deposition in order to provide cutting and grinding tools with improved wear resistance.

Abstract: An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.

Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.