Patents Assigned to OMNIVISION OPTOELECTRONICS TECHNOLOGIES (SHANGHAI) CO., LTD.
  • Patent number: 10155330
    Abstract: A method of forming packaged lens modules is disclosed which includes: securing first ends of a plurality of lens modules equidistantly on a first mold plate; providing a second mold plate matching with second ends of the lens modules and securing the second mold plate on the second ends of the lens modules; filling a black material in gaps between the lens modules; and removing the first and second mold plates after the black material is cured and performing a dicing process. The method can effectively block lens openings to protect lenses from being contaminated and can eliminate the need for adhesive application and removal generally performed on second ends of the lens modules, thereby resulting in time savings and an efficiency improvement. Additionally, a height of the resulting packaged lens modules can be modified for back focal length compensation thereof by changing the size of the second mold plate.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 18, 2018
    Assignee: OMNIVISION OPTOELECTRONICS TECHNOLOGIES (SHANGHAI) CO., LTD.
    Inventor: Regis Fan
  • Patent number: 10086545
    Abstract: A method of forming packaged lens modules is disclosed which includes: securing first ends of a plurality of lens modules equidistantly on a first mold plate; providing a second mold plate matching with second ends of the lens modules and securing the second mold plate on the second ends of the lens modules; filling a black material in gaps between the lens modules; and removing the first and second mold plates after the black material is cured and performing a dicing process. The method can effectively block lens openings to protect lenses from being contaminated and can eliminate the need for adhesive application and removal generally performed on second ends of the lens modules, thereby resulting in time savings and an efficiency improvement. Additionally, a height of the resulting packaged lens modules can be modified for back focal length compensation thereof by changing the size of the second mold plate.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: October 2, 2018
    Assignee: OMNIVISION OPTOELECTRONICS TECHNOLOGIES (SHANGHAI) CO., LTD.
    Inventor: Regis Fan
  • Patent number: 9359684
    Abstract: A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: June 7, 2016
    Assignee: OMNIVISION OPTOELECTRONICS TECHNOLOGIES (SHANGHAI) CO., LTD.
    Inventors: Chia-Ming Chung, Chien-Pang Lin