Abstract: A low-cost tamper-resistant product package is provided. The package comprises a substantially flat thermoplastic sheet forming a package backing, and a molded plastic cover sealed to the backing. The backing and cover are preferably formed of a plastic, such as polyvinyl chloride or polyethylene, that is difficult to puncture, cut or tear. The seal between the backing and cover is preferably difficult to compromise, so that human hands have great difficulty separating the backing and cover. RF welding and ultrasonic welding are preferred methods of sealing the package. The plastic backing is adapted to be printed upon directly. The cover preferably includes a ridge around its perimeter to inhibit bending of the package and assist in package display. The cover also preferably includes at least one bulge, forming therein a hollow recess for housing a product.

Abstract: A slotted holder is positioned in a shipping carton having a tear strip extending along its side walls. Product packages having a stiff thin edge fit within the holder and are held upright through the support of the holder. In use, the tear strip is removed enabling the upper portion of the box to be separated with the lower portion and serve as a display tray.

Abstract: A wafer polishing machine uses a pedestal unit that holds a semiconductor wafer using a vacuum force for polishing the surface of the wafer on a polishing pad and slurry mixture. A gimbal mechanism is implemented within the pedestal unit so that the various portions of the wafer surface are evenly polished. The gimbal mechanism enables the portion of the pedestal unit holding the semiconductor wafer to precess relative to that portion of the pedestal unit connected to the polishing machine. An elastomeric shim ring is also used within the pedestal unit to provide further compliance of the wafer surface to the various contours of the polishing pad during the polishing process.