Patents Assigned to OPPSTAR TECHNOLOGY SDN BHD
  • Three-dimensional FPGA with structure ASIC hardening capability
    Patent number: 11941336
    Abstract: Circuit devices include a first chip that includes functional blocks. A second chip has routing circuitry that provides configurable signal communications between functional blocks of the first chip and configuration memory that controls the routing circuitry and that further controls operation of the functional blocks of the first chip.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: March 26, 2024
    Assignee: OPPSTAR TECHNOLOGY SDN BHD
    Inventors: Kim Pin Tan, Hun Wah Cheah