Patents Assigned to OPROCESSOR INC
  • Patent number: 11970642
    Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: April 30, 2024
    Assignee: OPROCESSOR INC
    Inventors: Sahnggi Park, Kyungeun Kim
  • Publication number: 20230287245
    Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 14, 2023
    Applicant: OPROCESSOR INC
    Inventors: Sahnggi PARK, Kyungeun KIM
  • Patent number: 11746259
    Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: September 5, 2023
    Assignee: OPROCESSOR INC
    Inventors: Sahnggi Park, Kyungeun Kim
  • Patent number: 11300740
    Abstract: An optical module package may include a package substrate, an interposer on the package substrate, and a first semiconductor chip and a second semiconductor chip on the interposer. The interposer may include a silicon substrate having a first surface, which is adjacent to the package substrate, and a second surface, which is opposite to the first surface and adjacent to the first and second semiconductor chips, a penetration electrode penetrating the silicon substrate, a lower interconnection layer disposed on the first surface of the silicon substrate, and an optical waveguide, a first optical module, and a second optical module disposed in a lower portion of the lower interconnection layer. The first optical module may include a light source providing light into the optical waveguide, and the second optical module may include a photodetector receiving the light.
    Type: Grant
    Filed: March 27, 2021
    Date of Patent: April 12, 2022
    Assignee: OPROCESSOR INC
    Inventor: Sahnggi Park
  • Patent number: 11249261
    Abstract: The present invention includes a substrate, an optical waveguide on the substrate, a light source configured to provide light into the optical waveguide, and a prism between the light source and the optical waveguide. The light source includes a lens.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: February 15, 2022
    Assignee: OPROCESSOR INC
    Inventors: Sahnggi Park, Kyungeun Kim
  • Publication number: 20210214580
    Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.
    Type: Application
    Filed: January 10, 2020
    Publication date: July 15, 2021
    Applicant: OPROCESSOR INC
    Inventors: Sahnggi PARK, Kyungeun KIM
  • Publication number: 20210063653
    Abstract: The present invention includes a substrate, an optical waveguide on the substrate, a light source configured to provide light into the optical waveguide, and a prism between the light source and the optical waveguide. The light source includes a lens.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Applicant: OPROCESSOR INC
    Inventors: Sahnggi PARK, Kyungeun KIM