Abstract: An image sensor package includes an image sensor chip and crystalline handler. The image sensor chip includes a substrate, and a plurality of photo detectors and contact pads at the front surface of the substrate. The crystalline handler includes opposing first and second surfaces, and a cavity formed into the first surface. A compliant dielectric material is disposed in the cavity. The image sensor front surface is attached to the crystalline substrate handler second surface. A plurality of electrical interconnects each include a hole aligned with one of the contact pads, with a first portion extending from the second surface to the cavity and a second portion extending through the compliant dielectric material, a layer of insulation material formed along a sidewall of the first portion of the hole, and conductive material extending through the first and second portions of the hole and electrically coupled to the one contact pad.

Abstract: A microelectronic assembly for packaging/encapsulating IC devices, which includes a crystalline substrate handler having opposing first and second surfaces and a cavity formed into the first surface, a first IC device disposed in the cavity and a second IC device mounted to the second surface, and a plurality of interconnects formed through the crystalline substrate handler. Each of the interconnects includes a hole formed through the crystalline substrate handler from the first surface to the second surface, a compliant dielectric material disposed along the hole's sidewall, and a conductive material disposed along the compliant dielectric material and extending between the first and second surfaces. The compliant dielectric material insulates the conductive material from the sidewall. The second IC device, which can be an image sensor, is electrically coupled to the conductive materials of the plurality of interconnects. The first IC can be a processor for processing the signals from the image sensor.

Abstract: A 3D interposer (and method of making same) that includes a crystalline substrate handler having opposing first and second surfaces, with a cavity formed into the first surface. A layer of insulation material is formed on the surface of the handler that defines the cavity. The cavity is filled with a compliant dielectric material. A plurality of electrical interconnects is formed through the interposer. Each electrical interconnect includes a first hole formed through the crystalline substrate handler extending from the second surface to the cavity, a second hole formed through the compliant dielectric material so as to extend from and be aligned with the first hole, a layer of insulation material formed along a sidewall of the first hole, and conductive material extending through the first and second holes.

Abstract: A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces.

Abstract: A multi-layered lens having a substrate with opposing first and second surfaces. The substrate is formed of a plurality of discrete polymer layers. A cavity is formed into the first surface and is defined by a non-planar cavity surface that acts as a lens surface. The cavity extends into and exposes each of the plurality of polymer layers. The compositions of the polymer layers can vary to provide optimized focal properties. Alignment marks in the form of cavities or protrusions can be formed at the first surface or the second surface, so that multiple lenses can be stacked together in an aligned manner to form a stacked lens assembly.

Abstract: A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handier with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces.

Abstract: A 3D interposer (and method of making same) that includes a crystalline substrate handler having opposing first and second surfaces, with a cavity formed into the first surface. A layer of insulation material is formed on the surface of the handler that defines the cavity. The cavity is filled with a compliant dielectric material. A plurality of electrical interconnects is formed through the interposer. Each electrical interconnect includes a first hole formed through the crystalline substrate handler extending from the second surface to the cavity, a second hole formed through the compliant dielectric material so as to extend from and be aligned with the first hole, a layer of insulation material formed along a sidewall of the first hole, and conductive material extending through the first and second holes.

Abstract: A microelectronic assembly for packaging/encapsulating IC devices, which includes a crystalline substrate handler having opposing first and second surfaces and a cavity formed into the first surface, a first IC device disposed in the cavity and a second IC device mounted to the second surface, and a plurality of interconnects formed through the crystalline substrate handler. Each of the interconnects includes a hole formed through the crystalline substrate handler from the first surface to the second surface, a compliant dielectric material disposed along the hole's sidewall, and a conductive material disposed along the compliant dielectric material and extending between the first and second surfaces. The compliant dielectric material insulates the conductive material from the sidewall. The second IC device, which can be an image sensor, is electrically coupled to the conductive materials of the plurality of interconnects. The first IC can be a processor for processing the signals from the image sensor.

Abstract: An image sensor package that includes a handler assembly having a crystalline handler with a cavity formed into its first surface. The cavity has a stepped sidewall that defines at least one step surface extending inwardly inside the cavity. A plurality of conductive elements each extend from the step surface(s), through the crystalline handler and to its second surface. A sensor chip is disposed in the cavity and includes a substrate, a plurality of photo detectors formed at its front surface, and a plurality of contact pads formed at its front surface which are electrically coupled to the photo detectors. A plurality of wires each extend between and electrically connect one of the contact pads and one of the conductive elements. A substrate is disposed over the cavity and mounted to the crystalline handler. The substrate is optically transparent to at least one range of light wavelengths.