Abstract: The application discloses a ceiling grid multi-functional LED linear lamp, comprising: a main profile; an LED light bar, which is fixedly arranged on the inner bottom of the main profile; wherein both ends of the main profile are fixedly installed with mounting brackets, wherein the mounting bracket comprises a riveting bracket, a connecting piece and a movable bracket, the connecting piece is fixedly connected on one side of the bottom end of the riveting bracket, and the movable bracket is fixed on the back of the riveting bracket.

Abstract: A display panel, a method for detecting a display panel and an electronic device are provided. a display panel are provided, including a display area and a peripheral region surrounding the display area; a plurality of bonding pads in the peripheral region; a lighting pad in the peripheral region; a plurality of source signal lines at least in the display region; a plurality of source signal line leads in the peripheral region and electrically connected to the plurality of source signal lines and electrically connected to the plurality of bonding pads; a plurality of sub-pixel columns in the display region and electrically connected to the plurality of source signal lines; and a detection circuit, arranged in the peripheral region and between the plurality of binding pads and the display area.

Abstract: An infrared reflection device includes a power supply assembly, a plurality of switches, and two relatively disposed light-transmitting conductive substrates packaging a regulating area. Each of the light-transmitting conductive substrates comprise a light-transmitting substrate and an electrode layer. The regulating area is filled with a liquid crystal mixture; the electrode layers are arranged on opposite surfaces of the two light-transmitting substrates; the electrode layer of at least one of the light-transmitting conductive substrates comprises at least two mutually independent electrode areas; and electrode areas of the same light-transmitting conductive substrate, after being respectively connected in series to the switches, are jointly connected in parallel to the same electrode of the power supply assembly.

Abstract: Provided are a pixel circuit, a display apparatus and a driving method. In one type of pixel circuit, a first switch transistor is arranged between a gate electrode of a driving transistor and a second electrode of a first reset transistor, such that a leak current of the first reset transistor has a relatively small influence on a gate signal of the driving transistor. In other types of pixel circuit, a second reset transistor for short-circuiting the gate electrode and a first electrode is provided, such that the resetting of an anode of a light-emitting device is only related to a signal of a second reset signal end. Therefore, the voltage difference between two ends of a third reset transistor can be reduced by means of adjusting a signal voltage of a reference voltage signal end.

Abstract: A heating sticker includes a protective layer, a thermogenic layer, an electrode layer, a cover layer and an adhesive layer, which are superposed in order. The thermogenic layer is a conductive film with transparent carbon nanobuds and defined with a heating area and a non-heating area. The heating area is disposed with insulative grooves. The non-heating area is distributed with micro blocks which are arranged insulatively. The electrode layer has a conductive wire and a ground wire. The conductive wire surrounds the heating area in a non-closed shape. The ground wire is located between the front end and the rear end of the conductive wire and connected to a periphery of the heating area. Conductivity of each of the conductive wire and the ground wire is higher than conductivity of the thermogenic layer. An outer surface of the cover layer is a modified surface which is treated with plasma.

Abstract: The disclosure relates to a micro light-emitting component, a display device and a manufacturing method thereof, including: at least one support structure, the support structure is composed of a dielectric layer and/or a semiconductor layer to form a bridge arm structure; a semiconductor layer sequence; the semiconductor layer sequence is directly or indirectly in contact and fixed with the substrate through the bridge arm, and the support structure further includes a protrusion extending from the substrate toward the support structure, and a distance between the protrusion and the support structure is 0 µm to 1 µm, thereby improving the transfer yield of the micro light-emitting component.

Abstract: A nitride-based light-emitting diode (LED) device includes an n-type nitride semiconductor layer, an active layer disposed on the n-type nitride semiconductor layer, a p-type nitride semiconductor layer disposed on the active layer, and a defect control unit disposed between the n-type nitride semiconductor layer and the active layer. The defect control unit includes first, second and third defect control layers that are sequentially disposed on the n-type nitride semiconductor layer, and that have different doping concentrations. The third defect control layer includes one of Al-containing ternary nitride, Al-containing quaternary nitride, and a combination thereof.

Abstract: A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.

Abstract: Disclosed are an array substrate, a display panel, a display device and a method for manufacturing an array substrate. The array substrate includes a substrate and a film layer structure provided on the substrate. The film layer structure includes a first film layer segment and a second film layer segment provided at a periphery of the first film layer segment, a hollow portion for accommodating liquid crystal is formed on a side of the first film layer segment away from the substrate, and a distance between the hollow portion and the substrate is smaller than a distance between a side of the second film layer segment away from the substrate and the substrate.

Abstract: An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The optical semiconductor element mounting package has a recessed part that serves as an optical semiconductor element mounting region. The package includes a resin molding and at least a pair of positive and negative lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: Provided are a backlight board and a driving method thereof, a backlight module and a driving method thereof, and a display device. The backlight board includes light-emitting devices arranged in rows and columns and a first connector, where each first pin of the first connector is electrically connected to first electrodes of light-emitting devices in one row, each second pin of the first connector is electrically connected to second electrodes of light-emitting devices in one column; and in one drive cycle, a first drive signal drives light-emitting devices in each row for a duration T/n at different times, and a second drive signal drives light-emitting devices in each column for a duration T/n at different times.

Abstract: A manufacturing method of a display panel, a display panel, and a display apparatus. The manufacturing method includes: forming a plurality of backlight units on a process substrate; filling a partition between adjacent backlight units, where a height of the partition relative to the process substrate is greater than a height of the adjacent backlight units relative to the process substrate; preparing a filter layer on a surface of each of the plurality of backlight units away from the process substrate; stripping the backlight units with the filter layer on surfaces of the backlight units from the process substrate, and transferring to a target substrate; and packaging the target substrate.

Abstract: A micro light-emitting device includes a micro light-emitting diode and a light-emitting structure. The micro light-emitting diode includes a semiconductor light-emitting unit that emits an excitation light having a first wavelength. The light-emitting structure is disposed on the micro light-emitting diode, and is configured to be excited by the excitation light to emit an excited light having a second wavelength. The light-emitting structure is a multiple quantum well structure. A display including the micro light-emitting device is also disclosed.

Abstract: A packaging structure, which includes a metal bracket, a driver chip, a light-emitting component, a packaging member and a metal cover plate. The metal bracket includes a plurality of pins, and first and second surfaces oppositely disposed. The driver chip is disposed on the first surface, and configured to control a light-emitting state of the light-emitting component. The light-emitting component is disposed on the second surface and electrically connected to the driver chip through the metal bracket. The packaging structure is disposed on the metal bracket, and configured to fix the metal bracket and enclose the driver chip and the light-emitting component. The pins are disposed surrounding the driver chip and are partially exposed from the packaging member. The metal cover plate is disposed on a side of the driver chip away from the light-emitting component, covering an entire surface of the driver chip.

Abstract: A tire mold cleaning device includes a protective cover, a cleaning mechanism, a loading mechanism and a limiting mechanism. The cleaning mechanism is disposed in the protective cover; the loading mechanism includes linear sliding rails and a loading platform, the linear sliding rails are mounted at a bottom end of an interior of the protective cover, and the loading platform is connected to movable ends of the linear sliding rails. The limiting mechanism includes a base plate and limiting rods, and the base plate is disposed on a bottom end of the interior of the protective cover. A tire mold is cleaned through cooperation of the linear sliding rails and the loading platform, the limiting rods can limit a moving range of the tire mold, thereby preventing the tire mold from sliding under the action of inertia.

Abstract: Disclosed are a display device and a backlight module comprising a backplane and a backlight part provided on the backplane, in which a seam is provided between the two adjacent backlight parts; an adjustment part is installed at the seam; the adjustment part comprises: a connecting portion, an end of which is installed on the backplane through the seam, in which a depth at which the connecting portion is installed in the backplane is adjustable; and an adjustment portion provided at an end of the connecting portion away from the backplane, in which an outer diameter of the adjustment portion tapers along a direction toward the backplane, and an end of the adjustment portion enters the seam.

Abstract: Disclosed are a mask device, a manufacturing method thereof, an evaporation method and a display device. The mask device includes: a mask frame; at least one first mask strip extending in a first direction, at least one second mask strip extending in a second direction, and a first mask plate extending in the first direction, which are fixed on the mask frame. The first direction crosses the second direction, the first mask strip and the second mask strip are intersected to define at least one mask opening, the first mask plate includes a mask pattern region, and the mask pattern region includes a first group of through holes covered by an orthographic projection of the at least one mask opening on the first mask plate, and a second group of through holes covered by an orthographic projection of the first and second mask strips on the first mask plate.

Abstract: A display panel includes a substrate. The substrate includes a display area, an encapsulation area, and a peripheral area between the display area and the encapsulation area. The peripheral area comprises a signal transmission layer disposed on the substrate, a protruding structure disposed on the signal transmission layer, and a first electrode layer covering a surface of the protruding structure. The first electrode layer is electrically connected to the signal transmission layer.

Abstract: Provided is a black matrix structure. The black matrix structure includes a plurality of black matrix strips that are intersected with each other, wherein a width the black matrix strip ranges from 2 to 2.5 microns, and a distance between any two adjacent black matrix strips in the plurality of black matrix strips ranges from 4 to 5 microns.

Abstract: Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.