Abstract: A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Abstract: A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Abstract: To provide a processor and a processing method to make the operation to load and unload workpieces to and from a processing chamber more efficient, and improve workpiece processing efficiency.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: An architecture for substrate processing system wherein a group of several substrates are transferred simultaneously and processed simultaneously. Robot arm is used to transfer the substrates using a substrate hanger attached to the end thereof. The hanger is configured to slide above the substrates and pick up the substrates using hanger extensions that slide under the substrates and hold the substrates at their peripheral edge. By hanging the substrates from above, no regards to the position of lift pins is necessary. Also, by constructing the hanger to be symmetrical, the hanger motion is strictly linear and need not rotate. This saves transfer time and avoids collision with lift pins. Also, the symmetry and linear motion of the hanger maintains the substrates at the same relative position throughout the transfer and processing sequence.

Abstract: A showerhead for a plasma process apparatus for processing substrates, comprising a showerhead body comprising a top plate and a bottom plate defining a cavity in between; a gas inlet formed in the top plate; a perforated plate positioned between the top plate and the bottom plate and dissecting the cavity into an upper gas compartment and a lower gas compartment; and, wherein the bottom plate comprises a plurality of elongated diffusion slots on its lower surface and a plurality of diffusion holes on its upper surface, each of the diffusion holes making fluid connection from the lower gas compartment to more than one of the diffusion slots.

Abstract: A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: The substrate processing apparatus is capable of highly efficiently feeding and carrying out work and improving production efficiency. The substrate processing apparatus comprises: a processing chamber including a processing stage; a first load lock chamber for feeding the work, the first load lock chamber being communicated to the processing chamber; a second load lock chamber for carrying out the work, the second load lock chamber being communicated to the processing chamber; a first buffer storage being located between the processing chamber and the first load lock chamber, the first buffer storage storing the work to be transferred therebetween; and a second buffer storage being located between the processing chamber and the second load lock chamber, the second buffer storage storing the work to be transferred therebetween.