Patents Assigned to Ormet Circuits, Inc.
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Patent number: 11440142Abstract: Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.Type: GrantFiled: January 16, 2014Date of Patent: September 13, 2022Assignee: Ormet Circuits, Inc.Inventor: Catherine A Shearer
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Patent number: 11217554Abstract: Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.Type: GrantFiled: June 7, 2018Date of Patent: January 4, 2022Assignee: Ormet Circuits, Inc.Inventors: Matthew Wrosch, Catherine A. Shearer
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Patent number: 10727193Abstract: A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T1, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T1, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.Type: GrantFiled: April 27, 2016Date of Patent: July 28, 2020Assignee: ORMET CIRCUITS, INC.Inventors: Catherine Shearer, Eunsook Barber, Michael Matthews
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Patent number: 9583453Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.Type: GrantFiled: May 30, 2013Date of Patent: February 28, 2017Assignee: Ormet Circuits, Inc.Inventors: Catherine Shearer, Michael C Matthews, Peter A Matturi, Eunsook Barber, Richard Weaver
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Patent number: 9545017Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.Type: GrantFiled: February 18, 2014Date of Patent: January 10, 2017Assignees: Ormet Circuits, Inc., Integral Technology, Inc.Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
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Patent number: 9003648Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.Type: GrantFiled: December 28, 2007Date of Patent: April 14, 2015Assignee: Ormet Circuits, Inc.Inventor: Ken Holcomb
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Patent number: 9005330Abstract: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.Type: GrantFiled: December 31, 2012Date of Patent: April 14, 2015Assignee: Ormet Circuits, Inc.Inventors: Catherine Shearer, Peter A Matturri, Kenneth C Holcomb, Michael C Matthews
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Patent number: 8840700Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.Type: GrantFiled: November 5, 2010Date of Patent: September 23, 2014Assignee: Ormet Circuits, Inc.Inventors: Catherine Shearer, Kenneth C. Holcomb, G. Delbert Friesen, Michael C. Matthews
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Publication number: 20140231126Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.Type: ApplicationFiled: February 18, 2014Publication date: August 21, 2014Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
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Publication number: 20140120356Abstract: An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.Type: ApplicationFiled: March 15, 2013Publication date: May 1, 2014Applicant: ORMET CIRCUITS, INC.Inventor: ORMET CIRCUITS, INC.
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Publication number: 20140042212Abstract: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.Type: ApplicationFiled: December 31, 2012Publication date: February 13, 2014Applicant: Ormet Circuits, Inc.Inventors: Catherine Shearer, Peter A. Matturri, Kenneth C. Holcomb, Michael C. Matthews
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Patent number: 8221518Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal.Type: GrantFiled: March 31, 2010Date of Patent: July 17, 2012Assignee: Ormet Circuits, Inc.Inventors: Catherine Shearer, Kenneth C. Holcomb, G. Delbert Friesen, Michael C. Matthews
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Publication number: 20110171372Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.Type: ApplicationFiled: November 5, 2010Publication date: July 14, 2011Applicant: ORMET CIRCUITS, INC.Inventors: Catherine Shearer, Kenneth C. Holcomb, G. Delbert Friesen, Michael C. Matthews
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Publication number: 20100252616Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal.Type: ApplicationFiled: March 31, 2010Publication date: October 7, 2010Applicant: ORMET CIRCUITS, INC.Inventors: Catherine Shearer, Kenneth C. Holcomb, G. Delbert Friesen, Michael C. Matthews
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Publication number: 20100230145Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.Type: ApplicationFiled: December 28, 2007Publication date: September 16, 2010Applicant: ORMET CIRCUITS, INC.Inventor: Ken Holcomb
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Patent number: 6716036Abstract: Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.Type: GrantFiled: May 15, 2002Date of Patent: April 6, 2004Assignee: Ormet Circuits, Inc.Inventor: Pradeep Gandhi
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Publication number: 20030216061Abstract: Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.Type: ApplicationFiled: May 15, 2002Publication date: November 20, 2003Applicant: Ormet Circuits, Inc.Inventor: Pradeep Gandhi