Patents Assigned to OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
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Patent number: 10756383Abstract: General Formula (I) Provided is an all solid state secondary-battery additive comprising a polyalkylene carbonate (I) represented by general formula (I), and by providing such additive, properties such as the charge-discharge capacity and interfacial resistance of an all-solid-state secondary battery are improved. (In general formula (I), R1 and R2 are each a C1-10 chain-like alkylene group or C3-10 cycloalkylene group, m is 0, 1, or 2 and n is an integer of 10 to 15000, and each R1, R2 and m in the polyalkylene carbonate (I) chain is independently the same or different.Type: GrantFiled: August 16, 2016Date of Patent: August 25, 2020Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Masanari Takahashi, Mari Yamamoto, Yasuyuki Kobayashi, Shingo Ikeda, Yukiyasu Kashiwagi, Masashi Saitoh, Shuichi Karashima, Kiyoshi Nishioka, Ryo Miyabara
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Patent number: 10752755Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: GrantFiled: February 28, 2017Date of Patent: August 25, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Takayuki Hattori, Jyunichi Inagaki, Takafumi Kuninobu, Kazuhiro Takizawa, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Patent number: 10679922Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: GrantFiled: February 28, 2017Date of Patent: June 9, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Publication number: 20200123275Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: ApplicationFiled: May 9, 2018Publication date: April 23, 2020Applicants: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Patent number: 10421122Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.Type: GrantFiled: July 24, 2017Date of Patent: September 24, 2019Assignees: DAIHEN CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
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Publication number: 20190055444Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: February 21, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Patent number: 10202530Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.Type: GrantFiled: August 26, 2015Date of Patent: February 12, 2019Assignees: JNC CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Publication number: 20190023900Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Masako HINATSU, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Publication number: 20190023847Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, TAKAYUKI HATTORI, JYUNICHI INAGAKI, TAKAFUMI KUNINOBU, Kazuhiro TAKIZAWA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Publication number: 20180371197Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.Type: ApplicationFiled: December 26, 2016Publication date: December 27, 2018Applicants: SUMITOMO SEIKA CHEMICALS CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kiyoshi NISHIOKA, Hiroki MAEDA, Kei ISHIKURA, Kimihiro MATSUKAWA, Yukiyasu KASHIWAGI, Masashi SAITOH
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Publication number: 20180241077Abstract: General Formula (I) Provided is an all solid state secondary-battery additive comprising a polyalkylene carbonate (I) represented by general formula (I), and by providing such additive, properties such as the charge-discharge capacity and interfacial resistance of an all-solid-state secondary battery are improved. (In general formula (I), R1 and R2 are each a C1-10 chain-like alkylene group or C3-10 cycloalkylene group, m is 0, 1, or 2 and n is an integer of 10 to 15000, and each R1, R2 and m in the polyalkylene carbonate (I) chain is independently the same or different.Type: ApplicationFiled: August 16, 2016Publication date: August 23, 2018Applicants: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Masanari Takahashi, Mari Yamamoto, Yasuyuki Kobayashi, Shingo Ikeda, Yukiyasu Kashiwagi, Masashi Saitoh, Shuichi Karashima, Kiyoshi Nishioka, Ryo Miyabara
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Publication number: 20180111199Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.Type: ApplicationFiled: October 24, 2017Publication date: April 26, 2018Applicants: DAIHEN Corporation, Osaka Research Institute of Industrial Science and TechnologyInventors: Ryusuke TSUBOTA, Yohei OKA, Akira OKAMOTO, Takayuki NAKAMOTO, Takahiro SUGAHARA, Naruaki SHINOMIYA, Mamoru TAKEMURA, Sohei UCHIDA
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Patent number: 9938371Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.Type: GrantFiled: May 8, 2015Date of Patent: April 10, 2018Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Yukito Yada, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Patent number: 9890264Abstract: An objective of the present invention is to provide an organic-inorganic hybrid acrylic polymer having an increased refractive index, which has a higher transparency and a less impaired scratch resistance; a metal oxide dispersion and a polymerizable composition as materials for the polymer; and the organic-inorganic hybrid polymer capable of being produced in a crack-free manner. Another objective of the present invention is to provide a high-performance antireflection film using the organic-inorganic hybrid polymer. The metal oxide dispersion of the present invention comprises a phosphorus compound represented by Formula (1): (wherein, R1 is a hydrogen atom, an alkyl group, an alkynyl group, an alkenyl group, an aryl group, an aliphatic heterocyclic group, or an aromatic heterocyclic group; R2 is an organic residue; and n is 1 or 2) and a metal oxide.Type: GrantFiled: April 24, 2013Date of Patent: February 13, 2018Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIHACHI CHEMICAL INDUSTRY CO., LTD.Inventors: Kimihiro Matsukawa, Seiji Watase, Manabu Hirata