Abstract: A test socket for an IC device has relatively thin contact interface wall having an array of double-ended pogo pins. The double-ended pogo pins provide resilient spring-loaded contacts for the I/O contacts of an IC device held in the socket as well as for the circuit contacts of a PC board to which the socket is mounted.

Abstract: A connector system (20) connects a leadless integrated circuit (IC) device (22) to a printed circuit (PC) board (24) by means of a contact array (26). The contact array (26) connects input-output (I/O) contacts on the IC device (22) to corresponding circuit contacts (28) on PC board (24). The contact array (26) is a generally thin, flexible and rectangular shaped element that is sandwiched between the PC board (24) and the IC device (22). The contact array (26) has a plurality of square cells (30) that are each a portion of the array (26) and are formed from a planar body (32) of a suitable conductive material, such as beryllium copper, sandwiched between suitable insulating films, formed from polyimide. Each cell is divided into a first pair (34) of contact elements (36) extending above the plane of the body (32) and a second pair (38) of contact elements (36) extending below the plane of the body (32).

Abstract: A button contact and array of button contacts are provided for surface mounting a leadless IC device to a circuit board. The button contacts of the button contact array have a substantially flat body lying in a plane and oppositedly directed contact points protruding from resiliently deflectable contact support arms of said body. The button contacts of the invention, which provide a low profile contact between surface mounted components, are suitable for high frequency applications, and particularly high frequency test and burn-in applications, and are relatively durable.