Abstract: In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

Abstract: The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material (6) corresponding to the number of capillaries (4). An extracting station (19) is arranged in the transport path from the filling station (18) to the machining station (4?), said extracting station (19) extracting individual fragments of material (6) in a selective manner.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.