Abstract: The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.

Abstract: The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

Abstract: A semiconductor-chip stack package includes a plurality of semiconductor chips disposed in a stack arrangement and at least one connecting substrate which connects the semiconductor chips. The semiconductor chips include a chip terminal face on a chip edge extending at least partially as a side terminal face in a side surface of the semiconductor chip. The side surfaces of the semiconductor chips provided with the side terminal face are arranged in a shared side surface plane S of the semiconductor-chip stack arrangement. The connecting substrate is arranged with a contact surface parallel to the side surface plane S of the semiconductor chips. Substrate terminal faces are formed on the contact surface for connecting a connection conductor structure formed in the connecting substrate and which are connected to the side terminal faces via a connecting material in a connection plane V1 parallel to the contact surface.

Abstract: The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection senso

Abstract: A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.

Abstract: The invention relates to a method for placing and contacting a contact element formed in particular as a test contact of a test contact arrangement, wherein in said method, for forming a heat transfer surface, a contact head provided with a contact element holding device, with the contact element received in the contact element holding device, is placed between the contact element and a contact material deposit arranged on a contact surface of a contact carrier in the direction of a feeding axis against a contact surface of the connecting material deposit, and, for realizing an at least partial fusing of the connecting material deposit and for producing a materially bonded connection between the contact element and the connecting material deposit, thermal energy is introduced into the connecting material deposit by means of treating the contact element with thermal energy, the temperature T of the contact element being measured while the contact element is being treated and the duration of the treatment being

Abstract: A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position P1 to a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P3. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle ? with respect to the rotation axis.

Abstract: A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.

Abstract: The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.

Abstract: The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device

Abstract: A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

Abstract: The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening (37) of an application nozzle (36) of the application device into an application position P3, wherein a first detector device (69) for triggering a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device and a second detector device (80) for locating the solder mat

Abstract: The invention relates to a chip arrangement (18) comprising a terminal substrate (12) and a plurality of semiconductor substrates (1) which are arranged on the terminal substrate, in particular chips, wherein terminal faces (5) arranged on a contact surface of the chips (1) are connected to terminal faces on a contact surface (14) of the terminal substrate (12), wherein the chips (1) extend parallel with a lateral edge and transversally with their contact surface to the contact surface of the terminal substrate (12), wherein vias (13) are arranged in the terminal substrate, which connect external contacts (15) arranged on an external contact side to terminal faces formed as internal contacts (14) on the contact surface of the terminal substrate, wherein terminal faces of the chips, which are arranged adjacent to the lateral edge, are connected to the internal contacts of the terminal substrate by way of a re-melted solder material deposit (16).

Abstract: A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Abstract: The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.

Abstract: A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Abstract: The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.

Abstract: A device for positioning and contacting test contacts on a contact carrier for producing a test contact arrangement includes at least one contact head having at least one transmission channel for transmitting thermal energy. The contact head being equipped with a equipped with a test contact receptacle. The test contact receptacle includes a positioning device with at least two positioning faces for the positioned abutment against a test contact and the positioning of the test contact with an absorption region for absorbing the thermal energy in the channel mouth.

Abstract: A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.