Abstract: The present invention provides methods for treating ceramic materials, including oxide ceramic materials such as zirconia, with a treatment agent comprising a metallic material, such as titanium, by contacting a surface of the ceramic material with the treatment agent and heating the assembly to a temperature at which the ceramic material incorporates a portion of the metallic material by diffusion. The treated ceramic material is uniformly darkened and exhibits improved structural and physical properties.

Abstract: Methods for hermetically sealing an interface surface of ceramic materials, such as zirconia, to an interface surface of metallic materials, such as titanium alloys, using a titanium-nickel alloy filler material are disclosed. Preferred ceramic materials include stabilized zirconia materials; preferred metallic materials include titanium-niobium alloys; and a preferred titanium-nickel filler material is a 50-50 titanium-nickel alloy. At least one of the interfaces is contacted by the titanium-nickel alloy filler material and sealing is accomplished under vacuum conditions at temperatures of from 900 to 1200° C. during application of pressure to the joint. The methods are especially suitable for use in hermetically sealing ceramic and metallic components for applications such as implantable medical devices, electrical connectors, electronic packages, sporting goods, structural components, and the like.

Abstract: A microwave electronics package has a microwave waveguide window assembly hermetically sealed to the electronics package using an intermediate bimetallic bushing. The metallic components of the bimetallic bushing have thermal properties similar to the thermal properties of the housing and waveguide window frame, respectively, permitting the use of fusion welding techniques such as laser welding to hermetically seal the waveguide assembly in the housing and to preserve the integrity of the waveguide window during fusion welding and during thermal cycling of the electronics package. A microwave grounding element is also provided in the assembled electronics package to provide a continuous microwave ground path.

Abstract: Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.

Abstract: Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The methods and apparatus of the present inventions are especially suitable for hermetically sealing metal matrix composite electronics packages.