Abstract: An ultrasonic vibrating apparatus and an ultrasonic cleaning apparatus capable of permitting ultrasonic cleaning of a wafer to be carried out using an existing cleaning tank and while keeping the object immersed in cleaning liquid. An ultrasonic wave is irradiated to a cleaned object while keeping it immersed in cleaning liquid stored in a cleaning tank formed with an upper opening. A vibrating plate is securely mounted thereon with an ultrasonic transducer through a wave transmission element and arranged so as to close the upper opening of the cleaning tank in a cover-like manner. The vibrating plate is so arranged that a vibrating surface thereof downwardly faces and is immersed in the cleaning liquid.