Abstract: A system for continuously and configurationally heat soldering layered sheets of plastic, concomitantly with embossing a distinctive pattern across at least one face of the heat soldered seam. The disclosed system has at least one pressing face that includes the mirror image of the pattern to be embossed across a face of the seam, engraved therein. Pressing faces embedding electrical heaters provide for embossing a changeable content across the faces of the seam. Sealing band a pattern engraved across a face of which provides according to the present invention for embossing distinct three-dimensional geometrical shapes across the faces of the heat-soldered seams. A seam that is heat soldered according to the present invention continuously extends across two-dimensional contours of significant widths. Three-dimensional features having distinct sectional shapes protrude off the seam at least towards one direction.