Patents Assigned to Para Limited
  • Patent number: 7067229
    Abstract: The present invention relates to a conductive polymer. The present invention provides a conductive polymer substituted with acid labile functional group comprising an amine functional group and acid labile functional group which plays a protecting role substituted to the amine functional group of a conductive polymer. The conductive polymer of the present invention has enhanced physical and mechanical properties with higher solubility and conductivity than a conventional polyaniline or polypyrrole composition, and also, has improved transparency, sensitivity, adhesive property and patternability. Moreover, the conductive polymer of the present invention has the higher electrical conductivity of the minimum 10 times and the most maximum 102 S/cm than the previous polyaniline, and accordingly, can be used for photosensitive material such as fiber, coating, electrode, organic semiconductor and the like.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: June 27, 2006
    Assignee: Para Limited
    Inventors: Suck-Hyun Lee, Chan-Woo Lee
  • Patent number: 7064178
    Abstract: The present invention relates to an electrically conductive polymer, and more particularly to an additive for enhancing electrical conductivity of the polymer and electrically conductive polymer composition containing the additive. The present invention provides a soluble self-orienting material (SOM) and an electrically conductive polymer composition containing the SOM. The SOM can be provided as a form of a monomer having an aromatic ring with various polarity, flexible side chain and hydrophilic dibasic acid, as a form of a complex consisting of the monomers linked by a hydrogen bond or a metal coordinate bond or as a form of a whole aromatic polymer having —NRCO—, —NROSO—(R: side chain including —H, —CO2H, —(CH2)nSO3H, —(CH2)nCO2H or -tert-butyloxycarbonyl) and —OCO—. And also, the composition of the present invention have higher electrical conductivity, in excess of 103 S/cm, than a conventional conductive polymer, and also have improved processability.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: June 20, 2006
    Assignee: Para Limited
    Inventors: Suck-Hyun Lee, Chan-Woo Lee