Abstract: A component carrier tray for holding electrical components includes a support frame and a pocket insert supported by the support frame. The frame has at least one opening or concavity therein. The pocket insert is located in the opening or concavity and is formed of a high temperature semi-crystalline polymer. Each pocket insert is adapted to receive and hold at least one electrical component.

Abstract: A component carrier for holding a component includes a carrier substrate and a pocket recessed in the substrate for holding the component in its interior. The pocket has a wall and a floor, and the wall includes a series of elongated arcuate channels. The channels are concave relative to the pocket interior and extend substantially perpendicular to the pocket floor. The wall is substantially flat between the channels. A substantially continuous pedestal projects from the pocket floor. The pedestal has (i) an upper surface for supporting the component, (ii) a pair of support walls extending from the pocket floor and terminating in the support surface, and (iii) a notched portion intermediate the pedestal and defined by a lateral support member extending between the support walls and spaced from the pocket floor, for absorbing lateral components of compressive forces applied to the pedestal.

Abstract: A component carrier, for holding for purposes of automated visual inspection an electrical component having a lead with a free end, includes a carrier substrate and a pocket recessed in the substrate for holding the component in the interior of the pocket. The pocket includes a wall, depending from the carrier substrate and defining a lateral boundary of the pocket, and a bottom. There is a lead-tip horizontal plane and a lead-tip vertical plane when a correctly constructed component of the type the carrier is intended to hold is properly oriented in the pocket. The lead-tip vertical plane is perpendicular to a longitudinal axis of the pocket. The wall slopes down and inwardly at a first angle relative to the substrate through the lead-tip horizontal plane and at a second angle relative to the substrate through the lead-tip vertical plane. The first angle is greater than or equal to approximately 75.degree. and less than or equal to 90.degree., and the second angle is less than 90.degree.