Abstract: A clip is provided for holding a stack of trays and a tray cover. The clip has a base having a width providing clearance for a width of a tray and a cut-away relief area for finger access. First and second opposing resilient side walls and a resilient back wall extend upward from the base, forming a structure with an open front and top. First and second resilient, elongated and downwardly curved members are included, each having a proximal end attached to an upper front of a corresponding side wall, and a distal end attached to the back wall. The resilient members are positioned so as to apply pressure to first and second opposing perimeter portions of a tray placed in the clip.

Abstract: Apparatus and methods are presented herein for protecting electronic components from damage during transport or “drop testing.” A packaging system of the present invention includes a novel cover tape bonded to a carrier tape, which cover tape includes a foam layer attached thereto on its underside. The foam layer prevents excessive movement of the electronic components within the cavities, thereby protecting the leads and other parts of the components from damage. The method for protecting the components in the cavities of the carrier tape includes attaching the foam layer on the underside of the cover tape before sealing the cover tape on the carrier tape. When the cover tape is bonded to the carrier tape with the components placed in the cavities, the foam layer prevents excessive movement of the components therein.