Patents Assigned to Pensa Labs, Inc.
  • Patent number: 11173538
    Abstract: A device for bending wire includes a first plate with upper and lower surfaces and a center aperture extending therebetween. A cavity is formed in the upper surface that includes opposing sidewalls with a separation that decreases as they extend towards the center aperture and decreases as they extend up from a bottom surface of the cavity. A pin assembly disposed in the cavity includes a second plate having a pin extending from a top surface and having opposing side surfaces with a separation that decreases as they extend towards the center aperture and decreases as they extend up toward the top surface. A shaft extends through the center aperture and terminates in a bend head having a wire aperture and first and second bend surfaces adjacent the wire aperture. A first motor is configured to rotate the first plate about the shaft in opposing first and second rotational directions.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: November 16, 2021
    Assignee: PENSA LABS, INC.
    Inventors: Marco Perry, Oscar Frias
  • Patent number: 11167337
    Abstract: A device for bending wire that includes a pin extending from an upper surface of a plate, a shaft extending through a center aperture of the plate and terminating in a bend head, a sleeve rotatably disposed around the shaft, a first motor for rotating the plate about the shaft, and a second motor configured to move the plate between extended, retracted and intermediate positions along the shaft. The plate positioned in the extended position and rotating causes the first pin to travel in front of a wire aperture of the bend head. The plate positioned in the intermediate and the retracted positions and rotating causes the first pin to travel underneath the wire aperture. The plate positioned in the retracted position causes the plate to engage with the sleeve such that rotation of the plate causes rotation of the sleeve.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: November 9, 2021
    Assignee: Pensa Labs, Inc.
    Inventors: Marco Perry, Oscar Frias
  • Patent number: 10427208
    Abstract: A wire bending device that includes a housing have a top plate, wherein the top plate includes a curved slot, a first pair of opposing wheels positioned over the top plate for feeding wire, and a bend head. The bend head includes an aperture configured to pass the wire fed from the first pair of opposing wheels, and first and second bend surfaces positioned adjacent to the curved slot and the aperture. A cam member that includes sloping cam surfaces, and a rotating pulley, both positioned under the top plate and configured to cause a first pin to rise up and travel along the curved slot for engaging with and bending wire against the first bend surface, and to cause a second pin to rise up and travel along the curved slot for engaging with and bending wire against the second bend surface.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 1, 2019
    Assignee: Pensa Labs, Inc.
    Inventors: Marco Perry, Mark Prommel, Chad Ingerick, Pil Ho Chung, Avi Bajpai, Thomas Mattimore